August 11, 2023
Attendees at the upcoming 2023 Design & Simulation Summit, presented by Digital Engineering, will learn about the impact of artificial intelligence on designing for additive manufacturing; best practices for engineering simulation analysis; the role of requirements writing in the design workflow; real-world digital twin use cases; and more.
This is the third annual Design & Simulation Summit, presented by Peerless Media and Digital Engineering. The half-day virtual event is focused on technology innovations that enable simulation-driven design and engineering applications.
The online conference, which will take place on October 26, will kick off with a keynote panel discussion titled “What Can AI Bring to Design for Additive Manufacturing?” moderated by Senior Editor Kenneth Wong, that will cover potential uses of AI in DfAM scenarios, along with risks and challenges. Panel participants will include Chris McComb, Faculty Member at Carnegie Mellon University’s Department of Mechanical Engineering, and Matthew Shomper, CEO and founder of LatticeRobot.
McComb runs the Design Research Collective lab, and serves as the Director of the Human+AI Design Initiative, an interdisciplinary and international group of researchers focused on application of human-AI collaboration to design. Shomper has expertise in biomimicry and the design of 3D-printed medical implants, and also serves as principal engineer at Not a Robot.
Leading the Simulation Track session, “Engineering Analysis: The Good, the Bad and the Ugly,” is Ted Fryberger, president of engineering consulting firm DeepSoft Inc. The session will focus on best practices in performing FEA stress, thermal, and dynamics analyses; as well as manual calculations. He will also discuss what helps or hinders this process.
The Design Track session will be led by Mark Davies, director of HAAR Technology & Engineering. Davies will discuss improvements in standardizing requirements writing in the oil and gas industry, and how requirements specifications affect the design cycle.
In addition to those sessions, attendees will also learn about real-world use cases for digital twin technology in engineering scenarios. MingYao Ding, principal/VP Engineering at Ozen Engineering, will help attendees evaluate engineering computing options, including advanced workstations, high-performance computing (HPC) alternatives, and cloud computing.
Additional speaker and session information will be available over the next several weeks leading up to the event, which kicks off at 1 p.m. Eastern on Oct. 26, 2023.
About the Author
Brian Albright is the editorial director of Digital Engineering. Contact him at [email protected].Follow DE