Ansys Simulation Boosts Wireless Communication for Murata Manufacturing
Through a new multiyear agreement, Ansys’ comprehensive simulation portfolio will empower Murata to develop sustainable wireless connectivity products, Ansys reports.
November 1, 2022
As part of a new multiyear agreement, Ansys’ simulation tools will help Murata Manufacturing Co., Ltd. develop electronic components for next-generation wireless communication and mobility products.
Leveraging Ansys’ simulation portfolio will help Murata improve the efficiency and performance of its electronic components, which include radio frequency (RF) modules, multilayer resin substrates known as MetroCirc, and multilayer ceramic capacitors (MLCC). These components help expand high-frequency communications to support new-age connectivity demands while upholding sustainability initiatives.
The new multiyear agreement builds on Ansys’ existing relationship with Murata. Ansys HFSS 3D high-frequency electromagnetic simulation software helped enable the development of a direct-current-resonance method for wireless power transfer systems, which have the potential to charge more devices than batteries or wired systems have the capacity to power.
“Murata is leading innovation in wireless connectivity components and working toward a better environment by advancing technology for an Internet of Things (IoT) connected society,” says Norio “Nick” Yoshida, general manager of the computer-aided design (CAD)/computer-aided engineering (CAE) department at Murata. “Through this agreement, Ansys’ simulation solutions will support our design and development initiatives while enabling us to meet our sustainability goals and help expand our global market.”
The team will implement Ansys’ electronics system design tools to develop high-frequency devices and communications modules for the future that feature low-power consumption, high-power performance and improved reliability. With the ability to model phenomena such as electromagnetic interference (EMI), electromagnetic compatibility (EMC) and radio frequency interference (RFI), Ansys tools will help to solve complex and large-scale electronics engineering challenges.
“With wireless networks based on the technology of 5G and beyond, the demands of connectivity modules and components increase significantly,” says John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. “Ansys' simulation solutions not only meet today’s rising demands but remain ahead of them, and we are confident that Ansys’ electronics system design tools will equip Murata to develop the wireless connectivity possibilities of tomorrow.”
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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