November 21, 2014
Arkansas Power Electronics International (APEI), a manufacturer of high power density and high performance power electronics, has created a multiphysics simulation application with the all new COMSOL Application Builder.
APEI’s application examines fusing currents and ampacity of wire bonds. These bonds are small wires used to interconnect semiconductor devices with their packages.
One application function enables users to conduct a parametric sweep that shows how the number of wires affects peak wire temperatures. Before the application, engineers had to look at values in tables from multiple sweeps in Multiphysics. This application, the company states, helps simplify the process and generates more accurate, consolidated results.
“I’m building applications to help us expedite our design processes,” says Brice McPherson, a senior staff engineer at APEI. “Our engineers often spend time running analyses for the sales or manufacturing departments to find model results based on diverse conditions and requirements. The Application Builder will be hugely important for accelerating our work in this respect; any colleague outside of the engineering team will now be able to confidently run these studies by themselves, with no learning curve.”
The team at APEI expects to use the Application Builder for other projects, including applications for automating and streamlining the calculation of wire bond inductance, package thermal performance and layout analysis.
Learn more about currently available Application Builder-made applications in the video below by Senior Editor Kenneth Wong:
For more information, visit APEI and COMSOL.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
Subscribe to our FREE magazine,FREE email newsletters or both!
About the Author
DE’s editors contribute news and new product announcements to Digital Engineering.
Press releases may be sent to them via [email protected].