BE CAE & Test Creates Thermal Analysis App

BE CAE & Test has developed a new app with the COMSOL Multiphysics App Builder to perform virtual prototyping of their customers’ surface-mount device designs. The apps give users the ability to access, analyze and share information for thermal management.

Since the app helps perform thermal analysis, the temperature distribution within the device, maximum temperature reached, junction-to-case thermal resistance as a function of solder thickness, and dissipated power and constitutive material of the solder and the die are among the results presented to the app user, a company press release states.

“Apps mark a revolutionary page in the history of mathematical modeling and numerical simulation,” said Giuseppe Petrone, co-founder of BE CAE & Test. “These specialized and user-friendly tools bring the power of numerical simulation to a larger group of users. People with no prior experience from FEA or mathematical modeling can access, exploit, and benefit from analysis. As such, simulation apps can create more business opportunities with customers. Beyond simply providing them with a technical report, you are also supplying them with an interactive tool.”

For more information, visit COMSOL and BE CAE & Test.

Sources: Press materials received from the company and additional information gleaned from the company’s website.