Engineering Computing News
Engineering Computing Resources
November 24, 2020
As the need for faster, more frequent and more complex simulations increases, so does the need for compute resources that can handle these intensive operations. High-performance computing (HPC) clusters can provide that capacity, but these platforms can be challenging to maintain and manage in-house.
That was the challenge that Tokyo-based polymer manufacturer JSP faced at its North American headquarters in Michigan. On December 2, 2020, Ansys will host a webinar about how JSP is boosting engineering productivity with Ansys LS-DYNA and a managed HPC cluster appliance.
JSP manufactures ARPRO®, tiny beads of expanded polypropylene (EPP) foam that are used as the raw materials for everything from food packaging containers to car bumpers. CAE is a critical part of the company's operations, and the Michigan team performs all of JSP’s CAE work using LS-DYNA software running on an HPC cluster. These CAE studies go into the development of end products as well as optimization of the tools (or molds) used for manufacturing products. As part of its customer support commitment, the group provides full CAE support to their customers to design and develop ARPRO® products.
However, the aging HPC cluster was not able to keep up with expanding workloads. JSP deployed a turnkey, managed HPC cluster appliance from TotalCAE that provides a single interface for job submission, analytics, data management, backups and simulation software license management in a complete package.
The TotalCAE HPC appliance solution for Ansys software has helped JSP to improve accuracy, remove analysis bottlenecks and increase simulation performance by up to 35%, while also removing the HPC support burden from the company’s IT staff.
Check out the upcoming webinar on JSP and Ansys (registration required).