October 13, 2014
Kontron, a provider of embedded computer technology (ECT), today announced at the 2014 AUSA Annual Meeting and Exposition the availability of new I/O options with its next-generation Kontron high-performance embedded computer COBALT (Computer Brick Alternative) system to help reduce development costs and streamline the time to deployment.
The new I/O options are offered via COBALT’s mezzanine features, a ruggedized compact carrier board and system interface board (SIB). These basic modular and standards-based platform profiles match established development requirements for situational awareness, removable storage and combination processor/networking switch capabilities applicable to a wide range of ground, ship, avionics and unmanned military systems.
COBALT features a configurable front panel for modular I/O profile options. Enhanced I/O is achieved through 1x XMC slot, 2x mPCIe full slot or 1x mPCIe full and 2x mPCIe half. According to the company, these profile slots and front I/O panel allow full support for different profile options such as ARINC 429, MIL-STD-1553, combined L2/L3 GbE switch/processor, CANbus, Wi-Fi, WiMAX, 3G/4G modem, GPS, additional Serial Ports, FPGA, A/D and more.
Kontron says it designed the COBALT’s IP67 chassis to operate reliably in a multitude of conditions including extreme temperatures, shock, vibration and EMI. Powering the Kontron COBALT base system is a 3rd generation Intel dual core-based COM Express Type 6 module that features ECC, rapid shutdown design and 100% extended temperature screening with the option of removable or fixed SSDs and/or fixed mSATA storage, says the company. Windows, Linux and VxWorks operating system and software support packages are also available.
The Kontron COBALT provides a low profile, fanless and fully enclosed system that provides efficient thermal management in a 5.5 x 8.5 x 3.9-in. form factor weighing less than 6 lb.
For more information, visit the Kontron COBALT product page.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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