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Molex Introduces New CMC Standard Header and Solder-Mount Headers

Headers provide robust, sealed, wire-to-board connection systems for high-conductivity, high-vibration powertrain applications.

Headers provide robust, sealed, wire-to-board connection systems for high-conductivity, high-vibration powertrain applications.

By DE Editors

The Molex CMC product line now includes a 154-circuit header in compliant-pin mount, and 32- and 112-circuit solder-mount headers.  Designed to perform in high-conductivity applications and harsh environments, CMC is an industry standard interface used in automotive and transportation powertrain applications, including ECUs (engine control units), automatic gearboxes, suspension controllers and electric parking brakes.

The new 154-circuit, three-pocket, right-angle header with compliant-pin terminals improves productivity and reduces assembly costs by enabling a solder-free process, as opposed to conventional press-fit type mounting processes.  The 154-circuit header features 120 x 0.635mm (.025) signal pins, 24 x 1.50mm (.059)  terminals and 10 x 2.80mm (.110) power pins, supporting high currents in applications such as large ECUs.  The154-circuit connection system performs up to 50 mating cycles for mating and unmating of multiple ECUs on different applications.

The new 32-circuit, single-pocket, right-angle header, solder-mount terminals are designed for smaller powertrain applications, in addition to hydraulic and electronic suspension controllers.  The 112-circuit, three-pocket, right-angle header, which also features solder-mount terminals, is designed for any ECU application requiring a higher number of circuits.  Both the 32- and 112-circuit headers are constructed of hydrolytically stable, high flammability UL 94V-0 plastic material, suitable for epoxy adhesion.

For more information, visit Molex.

Sources: Press materials received from the company and additional information gleaned from the company’s website.


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DE Editors

DE’s editors contribute news and new product announcements to Digital Engineering.
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