Nano Dimension to Establish AME ACADEMY

Company teaming up with other industry suppliers to educate professionals on additively manufactured electronics.

Company teaming up with other industry suppliers to educate professionals on additively manufactured electronics.

The AME ACADEMY’s goal is to create a community that enables professionals to develop a deeper understanding of additively manufactured electronics technology. 


Nano Dimension Ltd., an additively manufactured electronics (AME) / PE (printed electronics) provider, has established the AME ACADEMY, with participation of other industry suppliers. Nano Dimension will serve as the co-host of the AME Academy sessions, an educational series that will educate corporate professionals, as well as individuals, about additively manufactured electronics. The virtual seminar, first of many annual events to be announced, is scheduled for February 23, 2021 from 10 a.m. to 6 p.m. ET.

The AME ACADEMY’s goal is to create a community that enables professionals to develop a deeper understanding of AME technology. 

The event will cover the current state and the predicted future of additively manufacturing electronics and look at applications, use cases, market trends and much more. Led by professionals from leading research institutions and commercial entities, participants will have the opportunity to network and exchange ideas in a virtual chatroom.

With industry leaders such as NovaCentrix, nScrypt Ink., IDTechEx and Electroninks co-coordinating the event, participants will learn firsthand about how new developments in AME technology are changing the way high-performance electronic devices (Hi-PEDS) are produced. IDTechEx, an independent market research company focusing on business intelligence and emerging technologies, will lead the first seminar and discuss market trends in the AME industry and provide insights about current and future opportunities for 3D electronics technology. The seminars will include classes on such topics as: “RF Devices and Antennas,” “Packaging,” “High Performance Materials for Next Generation Electronics,” and “Photonic Curing for Additive Manufacturing.”

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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