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Second Call for Speakers for 3D Collaboration & Interoperability Congress

Conference focuses on collaboration, simulation and integration.

Conference focuses on collaboration, simulation and integration.

By DE Editors

Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (3DCIC),  announced its second call for speakers for the 2014 event to be held May 28-30 at the Cheyenne Mountain Conference Center in Colorado Springs, CO.
 
The theme of 3DCIC 2014 is “Driving Product Development with Collaboration, Simulation, and Integration.” Conference organizers are looking for presentations from product designers, engineers, IT professionals or supply chain/downstream experts which focus on strategies, trade-offs and/or implementation case stories of real-world solutions in the following areas: Seamless integration of design,  analysis/simulation, manufacturing, downstream operations and the supply chain; building collaborative PLM into the global supply chain,  including such topics as change order management, intellectual property security and management; leveraging social media within companies and with suppliers; design-analysis/simulation or design-manufacturing collaboration and interoperability; PLM migration and legacy data management; and new technology for improving collaboration and interoperability and implementation
 
Anyone interested in speaking at the event should e-mail speaker name,  title and role, and a few sentences describing the proposed presentation to David Prawel at Longview Advisors by Feb. 15, 2014.
 
For more information, visit the 3DCIC  website.

Sources: Press materials received from the company and additional information gleaned from the company’s website.




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DE Editors

DE’s editors contribute news and new product announcements to Digital Engineering.
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