Engineering Computing News
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September 23, 2015
Super Micro Computer Inc., a provider of high-performance, high-efficiency server technology, has launched the line of 1U TwinPro SuperServers. These devices are designed for high availability head node and security appliance applications.
The dual hot-swap node architecture has new 900W/1000W redundant Titanium Level Power Stick modules. Each node supports dual Intel Xeon E5-2600 v3 processors, 4x hot-swap 2.5-in HDD drive bays and up to 1TB DDR4 2133MHz via 16x DIMM (dual inline memory module) slots.
“Supermicro’s new 1U hot-swap dual DP node TwinPro is exactly the best solution for customers that need high-compute density with full redundancy for high availability applications,” said Charles Liang, president and CEO of Supermicro. “With our Twin architecture featuring breakthrough redundant Titanium Level Power Stick modules, and PCI-E 3.0 x16 LP plus 1U optimized “0” slot expansion advantages, we provide maximum reliability and flexibility of configuration. The 1U TwinPro series will drive new opportunities for our customers that look for best performance, density and high availability in a 1U form factor.”
For more information, visit Supermicro.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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