July 14, 2020
Zuken has announced the CR-8000 2020 release of its advanced 3D multi-board EDA environment. Developed in close collaboration with customers, the company says that key development themes for CR-8000 2020 were “superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.”
Zuken says that user design efficiency will benefit from enhancements in the areas of schematic design, FPGA optimization, skew group routing and support of back-drilled vias. System-level design and verification have been enhanced in the areas of electro-mechanical co-design of flex-rigid PCBs and multi-domain analysis through direct integration of best-in-class solutions from Zuken’s partners, Keysight and Ansys.
The latest advancements in packaging technology are supported by new functionality for tile bump and 3D wire design planning.
“Our global development teams in Japan, USA, and Europe have been working very hard to evolve the capabilities of CR-8000, our flagship EDA design tool suite, to stay on top of the exacting requirements of our global blue-chip customer base,” says Kazuhiro Kariya, Managing Director of Zuken. “While our users will benefit from significant efficiency enhancements in the areas of engineering productivity and process resilience, we have also dedicated our attention to enabling a smooth transition for new customers who are locked into of third-party design tools that are reaching their limits.”
The CR-8000 platform is built upon the latest software methodologies and utilizes hardware acceleration to provide the needed performance for today’s complex and multi-discipline designs.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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