COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics® product is an integrated software environment for creating physics-based models and simulation applications. A particular strength is its ability to account for coupled or multiphysics phenomena.
Add-on products expand the simulation platform for electromagnetics, structural, acoustics, fluid flow, heat transfer, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics® simulations with all major technical computing and CAD tools on the CAE market.
Simulation experts rely on COMSOL Compiler™ and COMSOL Server™ to deploy applications to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL has 19 offices worldwide and extends its reach with a network of distributors.
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At the New Jersey Institute of Technology, one professor and his students designed 15 simulation applications for use in engineering and lab courses around the world.
Multidisciplinary modeling and simulation will play a larger role in solving electronics design challenges.
As natural disasters, the push for renewables and electrification mount pressure, simulation plays a key role in the U.S. power grid’s redesign and optimization.
Engineers at the Industrial Technology Research Institute built a simulation app that can be used to predict the performance of laser powder bed fusion, an additive manufacturing process. The app saves time and money during the additive manufacturing process for
Simulation needs test-based validation to be credible.
Industry insiders explain the difference between the two approaches.
CAD-integrated FE, templates and UI changes pave way for wider adoption.
Three-dimensional (3D) surround sound technology creates a premium and fully immersive audio experience for consumers. One company leading the development of such technology is Dolby Laboratories, headquartered in San Francisco, California, USA. Recently, they have been developing innovative 3D surround
Mathematical modeling and numerical simulation help accelerate the optimization of piezoelectric micropumps.
A focus on post-processing capabilities and creative use of emerging technologies takes the democratization of simulation to the next level, boosting accessibility of analysis-driven insights.
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