May 1, 2018
Inside this Issue:
COVER STORY: Engineering’s Link to Blockchain
The technology associated with cryptocurrency offers new approaches to data security and transaction record integrity. By Kenneth Wong
EDITORIAL
Are you tired of hearing about the in- ternet of things (IoT)? If so, you’re out of luck. Forecasts from industry experts vary a bit, but they all predict the billions of “things” con- nected to the internet will grow to tens of billions in just a few years. The IoT continues to grow by leaps and bounds because of the power of those connections.
WORKFLOW: Roadblocks Slow the Digital Twin Race
Companies are proceeding with caution on the digital twin journey, slowed by varying interpretations of the technology, complexity and lack of a package toolset. By Beth Stackpole
DESIGN: AutoCAD 2019 Review
The new release makes multiple products available for a single price. By David Cohn
SIMULATION: An ESRD CAE Handbook Look
Follow a fatigue crack problem and pre-load in a T joint.
EMI Simulation Advances
An increase in embedded electronics and IoT devices is spurring the use of electromagnetic interference simulation. By Brian Albright
ENGINEERING COMPUTING: Deep Learning Accelerates Product Development
A typical engineer can grasp the basics of deep learning tools in a day.
Lenovo ThinkPad P71: A New Performance Leader
Lenovo’s new 17-in. mobile workstation delivers even faster performance.
IOT: Facing the Embedded Security Crisis
Defense for cyberattacks must begin with device design.
Tiny Devices, Big Simulation Hurdles
Small form factor, intense computation and 3D-printed circuitry test the ECAD industry.
Latest News
