DE · Topics · Resources · Engineering Computing · Sponsored Content

High Performance Computing in the Cloud

AWS HPC solutions, available with the power of the latest Intel® technologies, help companies from small to large in nearly every industry achieve their HPC results with flexible configuration options that simplify operations.

Your Guide to High Performance Computing in the Cloud

Is your on-premises infrastructure up to the task? You have the talent, the ideas, and the drive. Now you need to generate the type of actionable results that bring your ideas to life and fuel continued research and discovery.

There’s just one problem:

Your on-premises infrastructure is holding you back. Your top engineers and researchers have to compete for access to run their high performance computing (HPC) workloads on the limited, on-premises capacity you have to help them make progress on their innovative ideas. Unable to test a full range of hypotheses, researchers become frustrated and demotivated, and may even discount possible breakthrough-generating work for fear of taking up valuable resources, only to potentially fail. Hardware upgrades take months to stand up—meanwhile, your research lags behind your competitors’ efforts.

It doesn’t have to be that way.

AWS cloud empowers you to push your ideas ahead at full speed. AWS offers Intel Xeon–powered compute instances to enable your engineers and researchers to innovate without constraints by offering virtually unlimited infrastructure enabling scaling and agility not attainable on-premises.

With easy access to numerous Intel optimized software libraries via the AWS Marketplace, your engineers can accelerate their development timelines even further.

Fill out the information below to download the resource.

For which of the industries do you perform design engineering or related functions? Select all that apply.
By downloading this content, I agree to receive the DE 24/7 Newswire, a twice weekly free email newsletter (you may choose to opt-out in the newsletter).

Latest News

WIN Enterprises Announces the MB-65040 Mini-ITX with Intel Scalable Skylake Processor
MB-65040 supports the Intel Skylake-S CPU and Intel H110 chipset.

Auburn University Deploys $1.5 Million Digital X-Ray CT System for Additive Manufacturing Purposes
Customized system enables layer-by-layer quality assessment in real time.

CONTACT Software Issues CONTACT Elements Release with Software Modules
Users can benefit from comprehensive functional enhancements and the integration of agile processes.

Mobile Analysis 3D and 2D CAD Viewer “to Go” Now on Market
The CoreTechnologie 3D_Analyzer Viewer is now available through a mobile license-lending feature.

All posts