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Delcam to Launch PowerINSPECT V5 at Control
PowerINSPECT supports Renishaw's REVO five-axis probe.
Lockheed Martin Unit Selects PTC’s Windchill
Product Development System to manage all critical product information.
VRMesh v4.1 for Pointcloud and Triangle Mesh Processing
Now diverse applications are possible with this affordable 3D tool.
New Mexico’s Supercomputer Completes Historic Test Run
UNM weather prediction project used $11 million Encanto.
NI Adds PCI and PXI PROFIBUS Interfaces
Engineers integrate NI LabVIEW software into benchtop, real-time, and device test PROFIBUS networks.
AVEVA ReviewShare for 3D Design Collaboration
View and markup is captured within the document, which can be circulated by e-mail.
ICE-Flow GlyphWorks Adds Python Scripting Language
Test data management enables custom glyphs.
IMS Software Releases IMSpost 7.4
New features for advanced machining and controller emulation.
TransTech Systems, Inc. Is COMSOL Certified Consultant
The Group falls under the umbrella of the TransTech R&D division.
LMS Partners with STUK Art Center in Belgium
Technology-oriented art project shows the longest crash car ever created.
Johnson Precision Adds 3D Prototyping Capability
3D modeling offered in ABSplus by U.S. injection mold maker.
EskoArtwork Introduces ArtiosCAD 7.3
For packaging professionals in structural design, product development, and prototyping.
All-Metal Case Guards Off-Road Mobile PC
For PCs exposed to tough field work in off-road vehicles.
Sun Introduces Carrier-Grade, 64-Thread Rackmount Server
Sun Netra T5220 server with the UltraSPARC T2 processor delivers 64 virtual systems in a 2U server.
3DSOM Creates 3D Models from Photos
Publish 3D models as Flash web pages using 3DSOM Pro 2.1.



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CADvizor CATIA 3D Integration Release
This AWS-certified solution is used across various industries including automotive, electric vehicles (EV), and agricultural machinery production, according to Yura.

What’s New in Simcenter FloTherm Releases
Highlights include material map capabilities for a PCB thermal analysis workflow, PCB thermal via modeling capabilities and more.

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