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Strategic Test Offers 125Msps 8-bit AWG Boards
Extend PCI Express series with 2-channel, expandable to 4 Gs.
Lambda Introduces DIN Rail-Mount Power Supplies
120W and 240W models for mid-power factory automation and process control applications.
Finisar Accelerates 10G Ethernet Server Connectivity
Laserwire uses fiber-optic technology to lighten the load for HPC.
FARO’s Sensor Probe by Renishaw for Quantum FaroArm
Plus, Laser ScanArm V3 announced for February.
Excel Introduces Version 3.0 of QuickUML Windows
Unified modeling language synchronizes editing changes across all models.
Dell Adds Tablet PC to Latitude Line
Lightweight convertible tablet uses capacitive touch technology.
ATMI and IBM to Develop Agreement for 45-,32- and 22nm Devices
Collaborate on next-generation semiconductor material and process development.
3D Systems Testing New Nanocomposite Material for RP&M
Still in beta testing; release planned for 2Q08.
Free STL Viewer
Free application offers fast STL inspection and compression.
Reverse Engineering
Leios Mesh now available as stand-alone product.
Nanocomposite for SLA
3D Systems introduces new temperature-resistant material.
Think3 Adds Reverse-Engineering Tool
Thinkreshape creates surfaces on point-cloud meshes.
Rapid Prototyping Service Expands to Europe
RedEye RPM opens facility for online RP orders.
Talking Touch Screens
Roland milling systems build 3D overlays for tactile tablets.
V-Flash Printer May Infringe on German Patents
3D Systems denies claim, says its patents are violated.



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BMF Gets FDA OK for Ultra Thin Dental Veneer Material
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Nexa3D and KVG Scale Defense Manufacturing Capabilities
The government contractor adds 15 high-speed extrusion printers from Nexa3D to meet demand for deployable 3D printing, organizations report.

KonnectAi Launches AI Quality Inspection Tool for Manufacturers
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