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microelectronics

The Partnership Seeking to Jumpstart Microelectronics Innovation
DARPA’s $200 million JUMP program aims to create a leap forward in U.S. electronics innovation.


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Optomec Introduces 3D Additive Electronics Printer for Inline Production
The Aerosol Jet HD2 is optimized for Advanced Semiconductor Packaging including mmWave applications.

Altair and Rolls-Royce Germany Partner on AI and Engineering
The collaboration is expected to drive transformative business value by reducing development time and costs.

Datakit Enhances SOLIDWORKS Converters
Datakit announces a wide range of new plug-ins.

INL Partners with Coreform
Collaboration designed to improve open-source modeling and simulation tool MOOSE.

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