The Partnership Seeking to Jumpstart Microelectronics Innovation
January 22, 2018
DARPA’s $200 million JUMP program aims to create a leap forward in U.S. electronics innovation.
Latest News
Optomec Introduces 3D Additive Electronics Printer for Inline Production
The Aerosol Jet HD2 is optimized for Advanced Semiconductor Packaging including mmWave applications.
Altair and Rolls-Royce Germany Partner on AI and Engineering
The collaboration is expected to drive transformative business value by reducing development time and costs.
Datakit Enhances SOLIDWORKS Converters
Datakit announces a wide range of new plug-ins.
INL Partners with Coreform
Collaboration designed to improve open-source modeling and simulation tool MOOSE.
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Editors’ Picks
Editor’s Pick: Static-dissipating composite material for electronics additive manufacturing
The material can be reinforced with continuous carbon fiber, creating strong and...
Editor’s Pick: UL Certification for Emissions-free 3D Printing
RIZE calls GREENGUARD Certification “a key safety and sustainability milestone” for the ...
Editor’s Pick: Debuting filament-based stainless steel for additive manufacturing
Forward AM/BASF Ultrafuse 17-4PH is a filament comprising metal powder...
Editor’s Pick: Faster production drawings from the 3D model
The company says every year it polls its users about what enhancements...