High Performance Computing
AWS provides the most elastic and scalable cloud infrastructure to run your HPC applications. With virtually unlimited capacity, engineers, researchers, and HPC system owners can innovate beyond the limitations of on-premises HPC infrastructure. AWS delivers an integrated suite of services that provides everything needed to quickly and easily build and manage HPC clusters in the cloud to run the most compute intensive workloads across various industry verticals. These workloads span the traditional HPC applications, like genomics, computational chemistry, financial risk modeling, computer aided engineering, weather prediction, and seismic imaging, as well as emerging applications, like machine learning, deep learning, and autonomous driving.
Now all researchers and students at academic institutions with a MathWorks Campus-Wide License that includes MATLAB Parallel Server have unlimited access to scale MATLAB programs and Simulink simulations to clusters and clouds.
The AMD Remote Workstation platform can help companies provide work-from-anywhere capabilities to designers and engineers.
Migrating to the cloud can enable engineers and scientists to remove engineering bottlenecks and quicken optimization cycles, providing design simulation results nearly instantly.
In this Q&A, Dr. Masha Petrova, VP of marketing at OnScale, talks about her company’s cloud-based methodology for solving problems, the 5G arena, and more.
Software development tools made by Renesas Electronics are created for cloud service applications linked with Amazon Web Services using vehicle data.
How to stay within ITAR’s rigid boundaries while straddling the cloud’s blurred borders.
Teamcenter software from Siemens PLM Software receives AWS Industrial Software Competency status after rigorous AWS technical validation.
There's a new APN Partner Competency Program from Amazon Web Services. Graebert was among the first Advanced Technology Partners to achieve the AWS Industrial Software Competency with its cloud-based CAD technology, ARES Kudo.
Program reportedly enables brands to streamline smart packaging solution development while building automated ordering and replenishment experiences for customers.
Cloud-based solutions allow engineers to access a wider variety of hardware instances than would be possible to support on-premise.