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Computer Aided Engineering

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VISI 2021 Improves Productivity for CAD/CAM Users
CAD, mold, progress, CAM, simulation and wire functions enhanced in latest release.
VISI 2021 Improves Productivity for CAD/CAM Users
CAD, mold, progress, CAM, simulation and wire functions enhanced in latest release.
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Using Synthetic Datasets to Train Embedded AI
This study demonstrates training and validating embedded AI algorithms using synthetic datasets derived from large numbers of parametric cloud simulations.
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Simulation of Ultrasonic Non-Destructive Testing of Composite Materials
This white paper provides an overview of how different NDT techniques can be modeled and simulated, highlighting the need for modern CAE tools that enable an efficient exploration of all variables involved.
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Get More from Your Investment in Simulation
Simulation's Potential is Being Needlessly Constrained.
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Computer-Aided Engineering on AWS Empowers Engineers to Innovate
Unleash productivity with CAE Today, computer-aided engineering (CAE) is standard in any industry that uses design software to develop new products or to create new features for existing products.
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OMNIS—Solving Your Toughest Industry Challenges
An end-to-end CAE environment from design to analysis and optimization.
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Solving The Toughest Engineering Challenges With HPC
Migrating to the cloud can enable engineers and scientists to remove engineering bottlenecks and quicken optimization cycles, providing design simulation results nearly instantly.
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Taking a Cloud-Based Approach to Computer-Aided Engineering
In this Q&A, Dr. Masha Petrova, VP of marketing at OnScale, talks about her company’s cloud-based methodology for solving problems, the 5G arena, and more.
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Hitting at the Hidden (and Not So Hidden) Costs of CAE
Today’s engineers use Computer Aided Engineering (CAE) software to solve a range of engineering problems associated with the mass production of products.


Latest News

Oqton and Valk Welding Partner for Automated Robotic Welding
Oqton is part of Valk Welding’s Automatic Robot Programming (ARP) solution for high-mix, low-volume production.

CADSoftTools Releases ABViewer v15.1
CADSoftTools announces ABViewer 15.1 with new features and enhancements.

C3Nano Unveils Conductive Curing Printable Ink Solution
C3Nano’sSuperGrid low-temperature process enables markets and applications for consumer electronics, flexible printed circuits, and interconnects, company says.

Siemens Advances Integrated Circuit Verification
Company debuts new, data-driven Questa Verification IQ software.

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