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Embedded Systems

dSPACE Launches Embedded PC Extension
The MicroAutoBox II has 8GB of DDR3 RAM and 128GB of flash memory, and is ideal for in-vehicle design use.
National Instruments Releases CompactRIO, System on Module
The devices are ideal for embedded technology testing and deployment.
Cathay Pacific Chooses Astronics Corporation’s Aircraft Interface Device for eEnabled Aircraft Program
The device has an embedded microprocessor, high I/O density and internal PMC slot.
Feeling the Heat from Electrical Engineering
The shift to circuits, systems on a chip, and software-driven products redefines the design engineer’s role.
Simulating M2M System Communication
Building machine-to-machine embedded systems can be complex and error-prone without simulating the communication among devices.
Mentor Graphics Acquires XS Embedded
The deal allows Mentor to expand its automotive embedded systems portfolio.
Sponsored Content
Top 10 Reasons to Use NI LabVIEW for Designing Embedded Systems
GE Partners With NVIDIA on High-Performance Embedded Computing Solution
Agreement enables GE to bring high-performance embedded computing to new power-constrained applications.
NVIDIA Launches High-Speed GPU Interconnect
Also releases mobile supercomputer platform for embedded systems.
dSPACE Releases TargetLink 3.5
Includes support for Simulink enum data types.
WIN Releases PL-80520 Compact Network Platform
Includes AMD Embedded G-Series SOC.
TI Unveils Streaming Audio Solution
Connected audio device designers can tap into any streaming client device from any manufacturer.
Embedded Systems Outlook 2013
WIN Enterprises Mini-ITX Motherboard Includes AMD Embedded APU
Unit is designed for digital image applications with multiple displays.
NIWeek 2013 Recap
Annual graphical system design conference and exposition draws record attendance, sees introduction of new products.

Latest News

IMAGINiT Launches Clarity 2023
This enterprise-level suite of products can improve architecture, engineering and construction firms’ advances in process automation.

Morf3D and Constellium Ink Joint Additive Manufacturing Program
Constellium's Aheadd CP1 offers benefits including thermal and electrical conductivity approaching that of pure aluminium, the company reports.

JIE USA Debuts 3D CAD Configurator Built by CADENAS
Motor and drive manufacturer unveils tool for on-demand, online design and product selection.

HP Shares New Platform Professional Services Updates
During RAPID + TCT, HP debuted new products and solutions.

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