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FEA


Laird Technologies Launches New Online EMI, Thermal Management, and Wireless M2M Solutions Stock Locator
March 5, 2010
System searches distributor inventory online.
Remcom Announces Flexible Payment Program for Electromagnetic Simulation Software
March 5, 2010
Program offers ownership benefits with quarterly, semi-annual, or annual payments.
Mentor Graphics Introduces FloTHERM IC
March 5, 2010
Designed for semiconductor package thermal characterization and design.
dSPACE and EB Create AUTOSAR Development Environment by Integrating Tools 
March 5, 2010
dSPACE's SystemDesk and TargetLink software matched with the EB tresos Studio configuration tool.
CFdesign’s Thermal Design Video
March 4, 2010
Silicon Frontline Technology Improves Performance and Capacity F3D and R3D
March 1, 2010
Company releases new versions of electronic design automation products for post-layout verification.
Aerospace Designers Tell Us about Must-Have Tools
March 1, 2010
The range of PLM and CAD-integrated solutions are critical for aerospace companies to keep pace with efficiency.
Maple 13, MapleSim 3 Boost Design Process 
March 1, 2010
Maplesoft builds on its legendary symbolic math engine to deliver comprehensive engineering simulations.
Managing Intense Numerical Analysis
March 1, 2010
Slice-it dice-it tools from NI, OriginLab, Tecplot, Visual Solutions, and Wolfram come with enough options to let you have it your way.
AVEVA is Building a Business Performance Center to Simulate Projects
February 26, 2010
Centre to provide a visualization experience for the plant and marine industry.
ORA’s LightTools 7.0 Delivers Expanded Capabilities for Illumination Design
February 26, 2010
Includes expanded model construction and system analysis functionality.
Fast App: T-Rex is Fast, Accurate Boundary Layer Meshing from Pointwise
February 24, 2010
Building higher-quality CFD meshes in less time that accurately resolve the boundary layer.
Tantalum Design Tools from AVX Promise to Speed Product Development
February 22, 2010
AVX enhances its free tantalum capacitor simulation, modeling and selection tools.
Dates Set for electronica 2010
February 22, 2010
Electronics industry will gather Nov. 9-12 at the Munich Trade Fair Center in Germany.
Measurement Computing Corporation Announces New DAQFlex Temperature Device
February 19, 2010
The USB-2001-TC thermocouple data acquisition device is now available from Adept Scientific.



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