DE · Topics · FEA

FEA


Laird Technologies Publishes Thermoelectric Handbook
Handbook provides a tutorial for thermoelectric module operation.
Meggitt Sensing Systems Introduces New Pressure Transducer
Endevco model 8515C designed for surface airflow measurements.
Saelig Introduces Customizable USB 2.0 Module
Saelig Company, Inc. has announced the QuickUSB, a customizable USB 2.0 connectivity solution. This 2 x 1 circuit board implements a bus-powered Hi-speed
Meggitt Sensing Systems Releases Endevco Accelerometers
High-G shock accelerometers have integral electronics.
Sherborne Sensors Releases LSI Series of Servo Inclinometers in North America
Servo Inclinometer family designed to withstand shock and vibration.
ASME Announces New Standard for Verification and Validation
ASME V&V 20-2009 standard addresses computational fluid dynamics and heat transfer.
Editor’s Pick: NEi Works 2.1 Debuts at SolidWorks World
New analysis types, usability enhancements among key new features in embedded Nastran tool.
NEi Works 2.1 Debuts at SolidWorks World
New analysis types, usability enhancements among key new features in embedded Nastran tool.
Anaglyph Releases Laminate Tools Version 4.0
New version introduces a geometry module for direct importing of CAD data.
Solid-State Drives: Speed and Efficiency
The advantages of systems from Fusion-IO, RocketDisk, Sun, and Texas Memory are many, but full integration is still a few years off.
MATLAB Central Has Answers to Share
The social product development capabilities of user communities brings like-minded designers and engineers together to share ideas.
Renewable Energy Options Multiply with CFD Solutions
Designers tap fluid analysis for high-performance renewable energy solutions.
Fast App: CD-adapco’s STAR-CCM+ Optimizes Sail Properties of the Largest Wing Ever for the BMW ORACLE Racing Team
CD-adapco's Anthony Massobrio interviews Mario Caponnetto, to discuss the BMW ORACLE Racing team's optimization of the Rigid Wing trimaran sail for the America's Cup competition.
FEA Software Innovator to Unveil NEi Works 2.1 at SolidWorks World 2010
Includes new features for users who need Nastran finite element analysis solutions.
Saelig Introduces USB Embedded Development Tool
The GP-24100 enables analysis of digital interfaces.



Latest News

PLM Intended to be More Accessible with Teamcenter X Essentials
Teamcenter X Essentials enables businesses to access Teamcenter X SaaS solution for PLM that is part of the Siemens Xcelerator...

Simr, Formerly UberCloud, Kicks Off SimOps for Product Development
$20M in Series A funding will be used to bring simulation best practices from the world's top companies to design...

Dell AI Factory Expands with NVIDIA
Expansion features new server, edge, workstation, solutions and services advancements that speed artificial intelligence (AI) adoption and innovation.

Renishaw Offers AM Support to Yacht for 37th America’s Cup
Renishaw, is supporting the team by providing them with additive manufactured products and solutions to maximize the performance of their...

New NVIDIA RTX GPUs Built for AI-Powered Design and Visualization
Based on the NVIDIA Ampere architecture, the new RTX A400 and RTX A1000 GPUs deliver real-time ray tracing and support...

Autodesk Offers Add-on for Manufacturing Sustainability Insights
The MSI add-on for Autodesk Fusion helps users discover the carbon impacts of design decisions.

All posts