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Made for You—Just You
Photogrammetry and AM open new markets for personalized healthcare, eyewear, jewelry and more.
Mercedes-Benz Funds Educational Initiatives in AI, Automated Driving at Universities
UC San Diego’s 3D imaging research allows Mercedes-Benz R&D North America (MBRDNA) to tap into the institutional research resources at the Autonomous Vehicle Laboratory.
Nanoscale 3D Printing Material Targets Microelectronics Applications
Stanford researchers marry metal nanoclusters with common polymers to create better lightweight 3D printed protective lattices.
Stanford Engineers Craft Novel Kind of 3D Printing
Dan Congreve, in electrical engineering at Stanford, and his colleagues have developed a way to print 3D objects within a stationary volume of resin.
Made for You—Just You
Photogrammetry and AM open new markets for personalized healthcare, eyewear, jewelry and more.
Stanford Center on Longevity Launches 6th Annual Design Challenge
Global design challenge calls for intergenerational cooperation.
Moving CAE Applications to the Cloud is Getting Easier
Today, major cloud hurdles are well understood and mostly have been resolved, and access and use of cloud resources became as easy as in-house desktop systems.
Stanford Center on Longevity Design Challenge Winners Announced
Stanford Center on Longevity's annual design challenge winning group from Virginia Tech University.
Standford University Engineers Create Ant-Size Radio
The no-battery device was created to help smart gadgets connect to the Internet of Things.
Stanford Team Measures Progress on Solar Car


Latest News

NVIDIA AI Summit: AI Powers Everything, from Autonomous Cars to the Search for Alien Life
NVIDIA's Bob Pette credits Tensor Cores and CUDA as the catalysts for AI revolution

MachineWorks and Productive Machines Ink Strategic Partnership
This collaboration aims to introduce efficiency in machining processes, the companies report.

OpenBOM Releases Major Update for Onshape
Look for new drawing features, simplified settings, and enhanced speed, company says.

Altair and Munich Technical School Partner on Quantum Computing
Research details solutions for several key challenges of quantum computing implementation.

@Xi Delivers AI Supercomputer to University of Wyoming
Not counting the CPU nodes, this new supercomputer power reaches up to 6.3 PetaFLOPS FP64/32 peak performance.

Ansys Teams Up with Microsoft and TSMC for Photonic Simulation
Companies collaborate to speed up simulation and analysis of silicon photonic components, according to Ansys.

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