What’s New in Simcenter Flotherm and Simcenter Flotherm XT 2210 Software

Model navigation, geometry selection and manipulation for large complex models is now faster and easier.

Model navigation, geometry selection and manipulation for large complex models is now faster and easier.

Discover what’s new in the Simcenter Flotherm and Simcenter Flotherm XT electronics cooling software 2210 releases.

In Simcenter Flotherm 2210 from Siemens, you can now export solid temperature results for the entire model, or a nominated assembly quickly. With one-click access, a Simcenter 3D standard file format (.FLD) is generated. Both steady state and transient temperature field data can be exported. For transient data, the entire event can be exported or smaller time period selections can be specified. This export process is also fully supported with scripting for any automation purposes.

Visualization Enhancements

Electronics thermal models often have 1000s of components. Model navigation, geometry selection and manipulation for large complex models is now faster and easier with an additional visualization window separate from the project manager window, according to the company.

This means as a user, you can open a Visualization Viewer separately and place alongside drawing board or existing analysis window, or it can be opened on a separate monitor. Object selection is synchronized across all windows and implemented changes show immediately.

Transient Thermal Analysis

Engineers can now accurately represent sub-microsecond time variations for thermal analysis of power cycling of IC packages, many power semiconductors and other devices and systems in Simcenter Flotherm.

IC Thermal Design

Detailed power maps extracted from silicon layouts in IC design workflows often have overlapping power blocks. Simcenter Flotherm users can now leverage overlapped power zones, defined in a CSV file and imported into the Die SmartPart.  This speeds up creation of accurate complex die structures by allowing greater flexibility, according to Siemens.

Simcenter Flotherm XT 2210—What’s New

There is a high accuracy setting for HyperLynx PI co-simulation. This co-simulation capability was originally released in Simcenter Flotherm XT 2020.2. Introduced now at the 2210 release are enhanced controls for co-simulation settings for how often power and thermal simulations are synchronized, which offers reduced overall simulation time. 

How to Incorporate a PCB solder Mask

As part of the commitment to modeling PCBs at all levels and stages, there is a new enhancement that allows users to better model correct physical dimensions of boards by including solder mask information.

Using EDA Bridge, users can now incorporate PCB solder mask layers during PCB import.  You can:

  • Control level of detail when transferring to main project
  • Choose options for importing whole board, or with separate settings for individual thermal territories.

Faster Definition of Pin or Via Material Properties 

Modern PCB designs may have a high number of Pins and Vias. If not using simply a default setting for all via and pin material properties, the assigning of different material properties to individual or groupings of hundreds of different via or pin geometry is a detailed time-consuming task during a model setup, SIemens reports.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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