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Study on HPC and Cloud Computing for Engineering Simulation
This new research report explores how companies are using HPC and simulation on the cloud.
Squashing Total Cost Rumors of In-House vs. Cloud Computing
More and more manufacturers are moving high-performance computing workloads to the public cloud. Total cost of ownership starts with the analysis and documentation of current in-house computing vs. cloud computing. Download this white paper to learn more.
Accelerating Electric Vehicle Development with Multidisciplinary Simulation and High-Performance Computing
In this new Making the Case guide, learn how a unified approach to design and multidisciplinary simulation from Dassault Systèmes, combined with high-performance computing powered by AMD EPYC™ processors, can accelerate EV design.
Ultra-high Accuracy, Precision, and Resolution Micro 3D Printed Medical Device Manufacturing
Discover how the use of micro-precision 3D printing is aiding medical device producers to tackle two common issues through this white paper.
Making the Case for Artificial Intelligence and Machine Learning in Engineering
In this paper, learn how AI and machine learning can improve design and simulation workflows.
Creating Your Smart Digital Reality™ for More Autonomous and Sustainable Industrial Facilities
Read this ebook to discover how to realize your Smart Digital Reality™ and make your industrial facility more efficient, profitable, safe and sustainable.
History of 3D Printing
While there’s been a recent boom in the popularity of 3D printing over the last decade, it’s actually been around for over 35 years. The technology started as an extremely expensive, niche method of manufacturing that held few advantages...
The Importance of Machine Tolerance to Achieve Exacting Results in 3D Printing
Increasingly, additive manufacturing is being used to produce end use parts, not just prototypes. For end use parts to be considered viable for this approach, there are many factors that need to be considered including materials, volumes, costs and tolerances.
Transform Your Digital Asset Lifecycle
Hexagon's digital asset management solutions can help change the way you work, optimizing projects from beginning to end.
Digital Engineering December 2022
Our December issue includes the results of our annual Technology Outlook Survey, as well as coverage of 4D printing, women in engineering, CAD interoperability, and AI for simulation.
Accelerate Business Value Through Unified Modeling & Simulation
Find out how organizations from multiple industries are defining their own MODSIM strategy. Learn from simulation, modeling, and design experts benefiting from a MODSIM approach.
Special Industry Focus: Aerospace
In this Special Focus Issue of Digital Engineering, learn about new innovations in aerospace design and engineering.
Unified Modeling and Simulation for Structure Development of Heavy Machinery and Equipment
The 3DEXPERIENCE Platform can help heavy mobile machine manufacturers innovate in a collaborative environment and overcome challenges, such as safety, that drive the market.
Introduction to MODSIM and Its Implementation Journey
Consumers demands are challenging new product development. To effectively meet these new challenges in delivering new products and features to market quickly, efficiently, and safely, the product development and manufacturing cycles must be tuned in a manner that provide the...
3DEXPERIENCE® Platform to Virtually Test Sustainable Packaging Solution
PepsiCo turned to Dassault Systemes for sustainable packaging solutions, while ensuring that these solutions were resistant to both shipping, and shelf damage.



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NVIDIA AI Summit: AI Powers Everything, from Autonomous Cars to the Search for Alien Life
NVIDIA's Bob Pette credits Tensor Cores and CUDA as the catalysts for AI revolution

MachineWorks and Productive Machines Ink Strategic Partnership
This collaboration aims to introduce efficiency in machining processes, the companies report.

OpenBOM Releases Major Update for Onshape
Look for new drawing features, simplified settings, and enhanced speed, company says.

Altair and Munich Technical School Partner on Quantum Computing
Research details solutions for several key challenges of quantum computing implementation.

@Xi Delivers AI Supercomputer to University of Wyoming
Not counting the CPU nodes, this new supercomputer power reaches up to 6.3 PetaFLOPS FP64/32 peak performance.

Ansys Teams Up with Microsoft and TSMC for Photonic Simulation
Companies collaborate to speed up simulation and analysis of silicon photonic components, according to Ansys.

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