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Editors Pick of the Week

Editor’s Pick: Accelerate Multidisciplinary Simulation
February 8, 2023
Ansys 2023 R1 update focuses on speed and capacity improvements, Ansys says.
Editor’s Pick: Understanding Complex Engineering Data
February 1, 2023
BETA CAE Systems starts year with new product announcements.
Editor’s Pick: Fusion 360 Direct Coordinate Measurement
January 25, 2023
ReverseEngineering.com 2023 Fusion 360 Faro and Romer Arms add-in allows the users of Autodesk Fusion 360 to import data directly from the scanning arm to the design software.
Editor’s Pick: Next-Gen Graphics Processing
January 17, 2023
NVIDIA RTX 6000 Ada Generation available from PNY.
Editor’s Pick: Increasing 3D printing productivity
January 11, 2023
Formlabs Automation Ecosystem for Formlabs 3D printers are designed to reduce the amount of operator labor and printer downtime when using multiple Formlabs printers. 
Editor’s Pick: Faster meshing for simulation
December 21, 2022
Coreform Cubit 2022.11 features impact core workflows including meshing, geometry modification and import/export. 
Editor’s Pick: Multi-system simulation
December 14, 2022
Elements from Hexagon can examine multiple physics and logic elements in one simulation.
Editor’s Pick: Major update for multiphysics simulation
December 6, 2022
COMSOL Multiphysics 6.1 update includes new simulation tools for audio technology and vehicle electrification.
Editor’s Pick: 3D printing at 25µm
November 30, 2022
Boston Micro Fabrication microArch S350 3D printer is the newest addition to BMF's family of micro-photopolymer 3D printers.
Editor’s Pick: Bringing quality control to additive manufacturing 
November 16, 2022
AM-QUALITY is a production line intelligent device to enable quality control monitoring for every part produced in a 3D printing process.
Editor’s Pick: HPC simulation on any desktop
November 9, 2022
Siemens says the new addition provides instant-on, rapidly scalable cloud-based HPC for the most demanding simulation studies. 
Editor’s Pick: Finite element analysis inside product design 
November 2, 2022
PTC's cloud-native Onshape Simulation is a new finite element analysis (FEA) solver.
Editor’s Pick: Adding digital twins to existing workflows
October 26, 2022
The new Altair digital twin initiative is said to enable existing Altair applications to connect and display in a digital twin environment.
Editor’s Pick: New platform for resin printing
October 19, 2022
Zortrax Inkspire 2 3D printing and post-processing system with cleaning and curing stations is now available directly from the manufacturer.
Editor’s Pick: Powerful CPU in compact tower form factor 
October 12, 2022
BOXX Technologies APEXX A3 workstation with AMD Ryzen 7000 CPUs built to handle powerful 3D design and rendering, company says.



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NIST Awards Money to ASTM for Standardization Center
The new center is intended to aid U.S. engagement in international standardization for critical and emerging technologies.

NVIDIA Shares Blackwell Platform Design for Open Hardware Ecosystem
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SME Appoints New CEO
Kunz brings 24 years of manufacturing experience, recently as SME’s chief workforce development officer.

Digital Twins in Action in Manufacturing
At the virtual Design & Simulation Summit on Oct. 31, learn how digital twins will affect product development through real-world case studies.

HPE Launches AMD-Powered Solutions
New purpose-built offerings to enhance training for complex AI models, HPE says.

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