Digital Engineering, March 2016

Inside this issue

Simulation-Driven Design Fast Tracks the Hyperloop

Startups, crowdsourced communities and competitions are transforming Hyperloop design concepts into early prototypes.

SIMULATE

Stress in Finite Element Analysis

To study stress, engineers must first determine the best way to define it.

Making Multiphysics Simulation More Accessible

Experts with multi-domain expertise are a rarity; multidisciplinary collaboration is the preferred approach.

PROTOTYPE

When Reality Becomes Virtual

Engineers are gaining more access to virtual and augmented reality thanks to cheaper technology.

DESIGN

The Growing Demand for On-Demand Licensing

New CAD users’ behaviors and preferences offer clues to subscription’s appeal.

ENGINEERING COMPUTING

Scan, Print, Collaborate

Mobility and cloud computing have augmented the next generation of largeformat printing and scanning offerings.

A True Desktop Replacement

The Eurocom Sky X9W delivers desktop power at a premium price.

WORKFLOW

Next-Generation Collaboration

Digital transformation demands the sharing of data with non-engineers, both inside the organization and out.

SPECIAL SUPPLEMENT: SENSORS

The Sensor Swarm Arrives

New design tools and workflows are needed to expand the limits of MEMS design.

Sensors Fast Apps

Robotiq and Universal Robotics help streamline product inspection; Minnetronix and Karten collaborate to create a user-friendly medical device.

Sensors to Specify

New products for a host of sensor applications.

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Latest News

PTC Releases Creo v11, Updates Creo+
This launch enables engineers to enjoy enhancements for electrification, composites, model-based definition, simulation-driven design and manufacturing, the company says.

CADENAS Announces Membership in Industrial Twin Association
The IDTA is the first point of contact for all aspects of the standardized digital twin.

Hexagon Announces Leadership Appointments
Hexagon Asset Lifecycle Intelligence Division appoints senior leadership.

Ingersoll Rand Leads $19M Financing Round for Inkbit
Inkbit will use funding to advance to multifunctional additive manufacturing.

CAD Users Embrace Hybrid Modeling
Subdivision modeling gaining ground in production phase surface modeling.

ESTECO International Users’ Meeting Announces Agenda
The early June meeting, to take place in Italy, includes keynotes from Toyota, Eaton and more.

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