Atos and Dassault Systèmes Join Forces to Deliver Sovereign Cloud Platform Experience
December 14, 2021
Clients can benefit from the combination of Dassault Systèmes’ 3DEXPERIENCE platform on the cloud and Atos’ OneCloud Sovereign Shield, according to the companies.
Dassault, STMicroelectronics, Others Team Up to Create Software Republique
April 12, 2021
New collaboration to serve as an ecosystem for intelligent and sustainable mobility.
CINECA to Build Fast AI Supercomputer with NVIDIA and Atos
October 16, 2020
New “Leonardo” system to deliver 10 exaflops of AI performance to power Italy’s HPC and AI research.
Atos Boosts Range of Supercomputers
June 20, 2017
Expansion of supercomputers by Atos to include ARM processors with new Bull Sequana X1310.
Atos to Provide GENCI with Supercomputer
June 15, 2017
The supercomputer will be used for research purposes in France and Europe.
Develop a New HPC Cybersecurity Mindset
May 24, 2017
High-performance computing (HPC) has opened the door to many innovations; yet, it has also introduced new cybersecurity challenges, as the computational power has attracted cybercriminals, as well as malicious insiders.
Materialise Summit Expounds on Next 3D Printing Frontier
May 2, 2017
The presentations and discussions at the recent Materialise World Summit in Brussels were about the disruption of all engineering and manufacturing processes, from initial design consideration to final part or product delivery.
Quick Electromagnetic Analysis of PCB Design
Autodesk Fusion 360 Signal Integrity Extension by Ansys reduces costs and improves compliance.
Editor’s Pick: Major update for multiphysics simulation
COMSOL Multiphysics 6.1 update includes new simulation tools for audio technology and vehicle electrification.
Epic Games to Use HOOPS Exchange for CAD Import
Epic Games switches to HOOPS Exchange for handling CAD model import
Sculpteo Publishes Updated Report on The State of 3D Printing
In this 8th edition, there are indicators that 3D printing is moving towards greater sustainability.
Editor’s Pick: 3D printing at 25µm
Boston Micro Fabrication microArch S350 3D printer is the newest addition to...
Editor’s Pick: Bringing quality control to additive manufacturing
AM-QUALITY is a production line intelligent device to enable quality control monitoring...
Editor’s Pick: HPC simulation on any desktop
Siemens says the new addition provides instant-on, rapidly scalable cloud-based HPC for...
Editor’s Pick: Finite element analysis inside product design
PTC's cloud-native Onshape Simulation is a new finite element analysis (FEA) solver.