The Quality Leader’s New Product Introduction Playbook
January 14, 2019
The market's visibility to early quality issues has never been greater and will continue to accelerate. The extensive awareness creates opportunities for the prepared enterprise, and substantial risks for those slow to react.
Quick Electromagnetic Analysis of PCB Design
Autodesk Fusion 360 Signal Integrity Extension by Ansys reduces costs and improves compliance.
Editor’s Pick: Major update for multiphysics simulation
COMSOL Multiphysics 6.1 update includes new simulation tools for audio technology and vehicle electrification.
Epic Games to Use HOOPS Exchange for CAD Import
Epic Games switches to HOOPS Exchange for handling CAD model import
Sculpteo Publishes Updated Report on The State of 3D Printing
In this 8th edition, there are indicators that 3D printing is moving towards greater sustainability.
Editor’s Pick: 3D printing at 25µm
Boston Micro Fabrication microArch S350 3D printer is the newest addition to...
Editor’s Pick: Bringing quality control to additive manufacturing
AM-QUALITY is a production line intelligent device to enable quality control monitoring...
Editor’s Pick: HPC simulation on any desktop
Siemens says the new addition provides instant-on, rapidly scalable cloud-based HPC for...
Editor’s Pick: Finite element analysis inside product design
PTC's cloud-native Onshape Simulation is a new finite element analysis (FEA) solver.