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EOS Launches New Systems

New materials complement announcement of new plastic laser-sintering system and two improved models.

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By DE Editors  

December 1, 2006

By DE Editors

EOS Systems (EOS of North America Inc., Novi, MI) introduced one newplastic laser-sintering machine and two improved models at the recentEuroMold exhibition in Frankfurt. Additionally, the company rolled outnew materials.

The new FORMIGA P 100's compact footprint and a height — 195 cm (76.77inches) — mean that it can fit in most any production environment.Additionally, its preparation and building process control can becarried out at the user's desktop. The unit's build envelope of 200 mmx 250 mm x 330 mm (7.87 x 9.84 x 12.99 inches), and the FORMIGA P 100is said to be able to build vertical walls with high-surface qualityand wall thicknesses as thin as 0.4 mm (0.02 inches.), which enables itto produce small components such as connectors. The new FORMIGA P 100is said to be able to plastic products directly from CAD data in lessthan 24 hours.

The new EOSINT P 730 is an advanced version of the earlier P 700system. Said to be the only double-laser system for plasticlaser-sintering, the P 730 is up to 40 percent more productive than theP 700. The EOSINT P 390 also offers increased productivity combinedwith better surface quality.

EOS Systems also presented a new version of its PSW process softwareand several new titanium alloy powders at EuroMold. The new titaniumalloys open up applications in the aerospace and medical industries.EOS Systems says that its new MaragingSteel MS1, amartensite-hardening, high strength, 18 maraging 300 steel (type1.2709), offers a significant increase in quality, particularly fortooling manufacture.

For complete details on the new EOS plastic laser-sintering machinesand new materials, go to the EOS Systems website by clicking here.

Sources: Press materials received from the company and additional information gleaned from the company's website.

 

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DE Editors

DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].

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