October 1, 2017
Inside this Issue:
Cover Story: Seeking Aerodynamic Perfection in Pixels and the Wind
F1 teams seek aerodynamic advantages in wind tunnels and CFD simulations.
Riding on the Speed of Additive Manufacturing and HPC
Formula One Teams Turn to 3D Printing and Cluster-Powered Simulation.
DESIGN: Removing the Meshing Bottleneck
The common goal is to get accurate results fast enough to streamline the engineering process.
SIMULATE: Topology Optimization Part 3
How to address manufacturing constraints in optimization.
Speakerless Sound
Continental’s new sound system is the result of extensive NVH and acoustic analysis.
NVH Engineers Take on New Challenges in Electric Vehicles
PROTOTYPE: Shatter Multimaterial 3D Printing Barriers
Multimaterial 3D printing capabilities usher in more realism to prototypes.
ENGINEERING COMPUTING Review: A Big & Powerful Workstation
We look at the Lenovo ThinkStation P910 Signature Edition.
Latest News
MSC Software Debuts MSC Nastran 2019.0 and MSC Apex
MSC Nastran is a FEA solver that enables simulation of various multidisciplinary engineering problems....
OPEN MIND presents hyperMILL 2019.1
OPEN MIND has expanded the finishing module in the hyperMILL MAXX Machining performance package.
Sintratec Offers Fully Integrated SLS System
Users benefit from a complete 3D printing system covering the entire processes from printing...
ABI Research’s New Industrial Solution Guides Manufacturers Through Digital Transformation
18 technologies help digitize operations to create better products at lower costs.
All posts
Editors’ Picks
Editor’s Pick: Machine Learning Boosts Modeling Methods
Automating your simulation workflows can help speed optimal design discovery.
Editor’s Pick: EDEM 2019 Rolls Out
Highlights include new multi-GPU solver engine and a breakage model sneak preview.
Editor’s Pick: DLP Printers Deploy 4M Pixel Projector
Pixel-tuning artificial intelligence boosts digital light processing to deliver high-quality 3D prints,...
Editor’s Pick: Overclocked Workstations Tuned for CAD, 3D Modeling, Animation
BOXX debuts its next-generation S-class APEXX workstations with overclocked 9th-Gen Intel CPUs.