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Cloud Computing

The Costs of the Cloud
May 1, 2013
As more engineers leverage high-performance computing, the true costs of a cloud-based model remain a mystery to many managers.
Aspen Labs, Digi-Key Announce PCBWeb
April 29, 2013
Free online design tools provide advantage for online printed circuit board design.
Penguin Computing Announces Icebreaker Cloud CS Storage Platform
April 26, 2013
New platform is powered by Scality object storage technology.
Univa Releases Univa Grid Engine 8.1.4
April 3, 2013
Includes new memory usage reporting and enhanced Intel Xeon Phi Coprocessor support.
Asite Ships Adoddle 15.7
March 31, 2013
New features added to cloud-based project management tool.
Autodesk to Offer MakerBot 3D Printers with 123D Apps
March 15, 2013
Collaboration will make 3D development easier for engineers, designers.
Cloud-hosted STEP file storage and sharing with MyCadbox
March 15, 2013
Vizerra Ships Revizto v1.1 for iPad, Android
March 11, 2013
Share 3D interactive designs in the field.
Dell, VMware Deliver Converged Infrastructure Solution
March 4, 2013
New system is optimized for desktop virtualization.
The Cloud: Driving a Hybrid
March 1, 2013
A hybrid cloud environment can combine private or public clouds, as well as on-premises implementations.
Online Collaboration with GTeam, 2 in a Series
February 15, 2013
5 Ways Engineering Apps Can Improve Workflow
February 1, 2013
Mobile offerings are finally starting to help streamline certain engineering workflows--while bolstering day-to-day productivity.
Kontron introduces SYMKLOUD Series
January 30, 2013
Cloud platform reduces power costs, space constraints of hosted services environments.
Sponsored Content
Check it Out: Try Simulation in the Cloud
January 22, 2013
Aspera fasp 3.1 Now Available
January 14, 2013
Latest version of high-speed transfer platform and SDK released.



Latest News

PTC Releases Creo v11, Updates Creo+
This launch enables engineers to enjoy enhancements for electrification, composites, model-based definition, simulation-driven design and manufacturing, the company says.

CADENAS Announces Membership in Industrial Twin Association
The IDTA is the first point of contact for all aspects of the standardized digital twin.

Hexagon Announces Leadership Appointments
Hexagon Asset Lifecycle Intelligence Division appoints senior leadership.

Ingersoll Rand Leads $19M Financing Round for Inkbit
Inkbit will use funding to advance to multifunctional additive manufacturing.

CAD Users Embrace Hybrid Modeling
Subdivision modeling gaining ground in production phase surface modeling.

ESTECO International Users’ Meeting Announces Agenda
The early June meeting, to take place in Italy, includes keynotes from Toyota, Eaton and more.

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