ALGOR V19.2 Features Enhancements to CFD and MES

Capability to model flow obstacles as distributed resistance parts andnew surface-to-surface contact options for more realistic mechanicalevent simulations among benefits.

Capability to model flow obstacles as distributed resistance parts andnew surface-to-surface contact options for more realistic mechanicalevent simulations among benefits.

By DE Editors

ALGOR(Pittsburgh, PA) announced that its latest finite element analysis(FEA) software release, ALGOR V19.2, features new enhancements forcomputational fluid dynamics (CFD) as well as mechanical eventsimulation (MES). The updates are aimed at providing users with morepower and flexibility while simplifying engineering analysissimulations.

New surface-to-surface contact options for more realistic simulationand faster solving of MES applications; faster, industry-standardsparse solvers for linear dynamic analysis, static stress analysis, andMES; new capabilities for modeling flow obstacles as distributedresistance parts; and distributed memory processing for 32- and 64-bitLinux (Red Hat) for static stress analysis and MES are among theimprovements.

According to a press release, modeling, meshing and solver enhancements provide significant speed and productivity gains.

“V19.2 provides our customers with many new and improved tools forincreased ease of use, productivity, and advanced analysisapplications,” said ALGOR Product Manager Bob Williams. “Our upcomingV20 software release will be a major update, which will feature a newoverall look and feel to FEMPRO, our easy-to-use, single-userinterface.”

Among other V19.2 features are Fempro’s ability to select a group ofvertices and project them onto a plane for alignment and the capabilityfor CSV file import/export of beam cross-section data; and improvedmeshing tools like mesh seed points for specifying locations of nodes.The new release also includes a preconditioned bi-conjugate gradientstabilized iterative solver for heat transfer analysis and a thin shellelement formulation with bilinear von Mises material model in its MESsolver.

There is also improved support for importing NASTRAN models with PSHEARand CSHEAR cards, improved formulation of plate elements forindustry-standard NASTRAN compatibility, the capability to displayelectrostatic charge results, and more.

For more information, visit algor.com.

Sources: Press materials received from the company. Additional information gleaned from the company’s website.
 

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