ALGOR V23 Offers Design & Analysis Upgrades for CAE Simulation

By DE Editors

ALGOR V23 upgrades CAE tools that ALGOR users worldwide rely on for design and analysis of their products. Increased capabilities exist for modeling,  analysis, results evaluation, and presentation.

ALGOR, Inc.’s (Pittsburgh, PA) latest finite element analysis (FEA) software release, ALGOR V23, upgrades the computer-aided engineering (CAE) tools that ALGOR users worldwide rely on for design and analysis of their products.

New modeling features include “smart” bonded contact that uses multi-point constraints to bond the surfaces of unmatched meshes. Models created in ThinkDesign from think3,  Inc. (Cincinnati, OH) can be opened in ALGOR for fully associative analysis; a new utility generates vertices and beams to replace non-essential surfaces; and more.

Upgraded analysis features include expanded implementation of the multifrontal massively parallel solver (MUMPS) for distributed memory systems on both Linux and Windows clusters, using both in-core and out-of-core memory for faster solution of linear and nonlinear stress and fluid flow models; and improved 2D steady fluid flow analysis.

Enhanced results evaluation and presentation include stress and strain results for midside nodes can be displayed; beam code checking for Mechanical Event Simulation (MES) to verify compliance with the industry-standard AISC ASD structural code; and improved report generation.

Other improved features of ALGOR V23 enhance static stress with linear and nonlinear material models, Mechanical Event Simulation (MES)  for nonlinear, multi-body dynamics with large-scale motion, large deformation and large strain with body-to-body contact; and more. All analysis capabilities are available within FEMPRO, ALGOR’s easy-to-use single user interface.

To see a free learning session on the new ALGOR V23, view What’s New Featuring V23 webcast at ALGOR.

Sources:  Press materials received from the company and additional information gleaned from the company’s website.