Coolit v.8 Thermal & Flow Software for IC Package Modeling

By DE Editors

Daat Research Corp. (Hanover, NH) announced the addition of tools for modeling IC packages into its Coolit v.8 CFD thermal analysis software. The tools build detailed parametric chip models that can be converted to compact models, and the user can switch between detailed and compact models as desired.

Included is a library of hundreds of popular Ball Grid Arrays (BGA), Dual Inline Packages (DIP), and Quad flat Packages (QFP). The user can copy and modify the models,  or add new models to the library.

Coolit v.8 also delivers improvements in algorithms for computation and presentation of results.

For more information, visit Daat Research.

Sources:  Press materials received from the company and additional information gleaned from the company’s website.