CoolitPCB v4.0 Thermal Software Delivers Detailed IC Models

By DE Editors

The introduction of CoolitPCB v 4.0 from Daat Research (Hanover, NH) marks a new thermal modeling option for PCB designers, says the company. Users can construct detailed models of Ball Grid Arrays (BGA), Dual Inline Packages (DIP), and Quad Flat Packages (QFP), or alternatively, select IC packages from hundreds in the new IC Packages Library,  modify them, and save the results. With just a click, the models can be converted quickly into compact models for faster rapid computation.

CoolitPCB v4.0 is a cost effective and easy-to-use CFD software that enables PCB designers to do their own board-level analysis, accurately predict the thermal behavior of their designs, and pinpoint optimum component placement on their boards. Under the hood is a proven and advanced computational engine, developed by Daat Research Corp. and used on many design projects.

CoolitPCB v4.0 is priced at $3200 for an annual (node-locked) license. The optional IC Package Dialog and Library is priced at $1500. Other licenses are available.

For more information, contact Daat Research.

Sources:  Press materials received from the company and additional information gleaned from the company’s website.