Digital Engineering 24/7

Helping design and engineering professionals discover, evaluate and specify technologies and processes that shorten the design cycle and enable success.

Kontron Announces the 3U CompactPCI Processor Board CP3002

Standard air-cooled version based on the latest Intel Core i7 processor.

Latest Engineering Computing News

Latest Engineering Computing Resources

By DE Editors  

December 6, 2010

By DE Editors

Kontron has introduced the standard air-cooled version of the Kontron 3U CompactPCI processor board CP3002 based on the latest Intel Core i7 mobile processor technology and Intel Platform Controller Hub QM57. The fanless Kontron CP3002 is targeted for standard application environments with forced airflow.

The newest processor board extends Kontron’s CP3002 line of 3U CompactPCI processor boards, which are also available in Rugged Conduction-Cooled (Kontron CP3002-RC) and Rugged Air-Cooled (Kontron CP3002-RA) variants for applications in harsh environments.

With the 2.53 GHz Intel Core i7-610E and the LV 2.0 GHz Intel Core i7-620LE processor, the Kontron CP3002 not only speeds up multiprocessing tasks via hyper-threading technology (HTT), but also processes single-threaded tasks much faster thanks to the new Intel Turbo Boost technology. This allows for a clock speed of up to 3.33 GHz without exceeding the defined thermal design power (TDP) and without the need to oversize the entire system for peak loads, according to the company.

The Kontron CP3002 runs with Microsoft Windows 7, Windows 7 Embedded Standard, Windows XP, Windows Server 2003, Windows Server 2008, Linux, and VxWorks. Samples of the Kontron CP3002 3U CompactPCI processor board are available now. Full production is scheduled for the first quarter of 2011.

For more information, visit Kontron.

Sources: Press materials received from the company and additional information gleaned from the company's website.

 

Latest in Engineering Workstations

About DE Editors

DE Editors

DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].

Follow DE
on Facebook
on Linkedin

Related Topics

Engineering Computing   News   Products   Engineering Workstations   High–performance Computing HPC   All topics
 

Subscribe

Subscribe to our FREE magazine, FREE email newsletters or both!

Join over 90,000 engineering professionals who get fresh engineering news as soon as it is published.

Subscribe today

 
 

From our Sponsors

Meltio Takes Metal Additive to the Next Level
Meltio's DED technology enables industries to tailor and customize their solutions to create & repair metal parts.
Easing the Transition from ETO to CTO with Configuration Lifecycle Management
Manufacturers are discovering that the Configure-to-Order (CTO) model provides significant benefits when it comes to customization.
Siemens + Altair = The Next Chapter in Design and Simulation
With its acquisition of Altair, Siemens creates a unified simulation portfolio combining generative design with high-performance computing and AI workflows.