Mentor Graphics to Utilize Spatial 3D Components in PCB Systems Design Products

Spatial components to assist with 3D modeling, design, and mechanical analysis.

Spatial components to assist with 3D modeling, design, and mechanical analysis.

By DE Editors

Spatial Corp. has announced that Mentor Graphics Corporation will use Spatial’s 3D software components in select Mentor product offerings. Spatial components assist with 3D modeling and analysis within Mentor’s PCB systems design and mechanical analysis products.

Mentor’s Expedition Enterprise PCB systems design flow contains many processes that incorporate 3D design, analysis and visualization capabilities. Some of these also require integration and collaboration with activities typically performed in the mechanical design and analysis domain. According to the company, the implementation of Spatial’s 3D components provides higher performance full 3D design in the electronic domain and tighter integration with the mechanical domain.

The Spatial components in the agreement include the 3D ACIS Modeler for wireframe and solids modeling, the 3D InterOp for data exchange of parts and assemblies to/from MCAD systems, the 3D Mesh toolkit for surface and volumetric meshing, and the 3D Visualization framework.

For more information, visit Spatial Corp. and Mentor Graphics Corporation.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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DE Editors

DE’s editors contribute news and new product announcements to Digital Engineering.
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