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December 4, 2001
REDCOM Laboratories Inc. announced the availability of a new high-speed Surface Mount Technology (SMT) assembly line at its headquarters in Victor, NY.
According to a company press release, the line will include state-of-the-art assembly and inspection equipment plus the latest on-line New Product Introduction and performance monitoring tools. The line will be used to assemble and inspect Printed Circuit Board Assemblies (PCBAs).
Some elements of the new system include:
- Universal Fuzion SMT Component Placement System (48K placements/hour)
- Vitronics Soltec XPM3i 820 Reflow Soldering System
- Vi Technology 5K SPECTRO Automated Optical Inspection
- Air-Vac Engineering ONYX 29 Advanced SMT Production Rework & Assembly
For more information, visit REDCOM Laboratories.
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Latest News
Next-Gen: Imagination-Fueled Problem-Solving
Case Study: Sintavia Extends Vertical Integration Strategy to Software
Kubotek Kosmos Releases CAD Utilities v6.0
Ansys Partners With OEM SynMatrix
AMUG Bestows Rare Lifetime Achievement Award to Industry Veteran
Additive Manufacturing Solutions Uses Nikon SLM Solutions’ Technology
All posts
About the Author
Jess LulkaJess Lulka is a former associate editor for Digital Engineering. Contact her via [email protected].
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