
February 1, 2016
Inside this issue
MCAD and ECAD: Don’t Throw It Over the Wall!
Connected devices redefine today’s MCAD-ECAD co-design protocols.
PROTOTYPE/MANUFACTURE
3D-Printed Electronics Charge Ahead
Small teams and big companies are developing a wide range of 3D-printed electronics applications.
FOCUS ON THE INTERNET OF THINGS
Decoding the IoT Development Platform
The broad technology stack required for IoT product development dictates that engineering teams rely on multiple development platforms.
The Emergence of Deep and Machine Learning
Increased research is paving the way for the next generation of smarter products.
Seeing Digital Double
Digital twins create an unprecedented design feedback loop thanks to the convergence of the Internet of Things, augmented reality and advanced simulation.
Making Sense of Sensors
Multi-layer integration for the IoT.
Consultant’s Corner: IoT
How enterprise IoT changes product design.
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Editors’ Picks

Editor’s Pick: Plug-and-play monitoring of 3D print jobs
The software is designed for any 3D printer using the Marlin open...

Editor’s Pick: Design for metal additive manufacturing as a service
3DEO's new advisory service is built to allow the company to better...

Editor’s Pick: Industrial ceramic 3D printing
3DCeram C1000 FLEXMATIC Ceramic 3D printer provides a semi-automatic approach to industrial ...

Editor’s Pick: Improved PCB workflow in MCAD
New features in the Siemens NX Summer 2022 update will enable users to...