Digital Engineering, February 2016

Inside this issue

MCAD and ECAD: Don’t Throw It Over the Wall!

Connected devices redefine today’s MCAD-ECAD co-design protocols.


3D-Printed Electronics Charge Ahead

Small teams and big companies are developing a wide range of 3D-printed electronics applications.


Decoding the IoT Development Platform

The broad technology stack required for IoT product development dictates that engineering teams rely on multiple development platforms.

The Emergence of Deep and Machine Learning

Increased research is paving the way for the next generation of smarter products.

Seeing Digital Double

Digital twins create an unprecedented design feedback loop thanks to the convergence of the Internet of Things, augmented reality and advanced simulation.

Making Sense of Sensors

Multi-layer integration for the IoT.

Consultant’s Corner: IoT

How enterprise IoT changes product design.

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