Digital Engineering, February 2016

Inside this issue

MCAD and ECAD: Don’t Throw It Over the Wall!

Connected devices redefine today’s MCAD-ECAD co-design protocols.

PROTOTYPE/MANUFACTURE

3D-Printed Electronics Charge Ahead

Small teams and big companies are developing a wide range of 3D-printed electronics applications.

FOCUS ON THE INTERNET OF THINGS

Decoding the IoT Development Platform

The broad technology stack required for IoT product development dictates that engineering teams rely on multiple development platforms.

The Emergence of Deep and Machine Learning

Increased research is paving the way for the next generation of smarter products.

Seeing Digital Double

Digital twins create an unprecedented design feedback loop thanks to the convergence of the Internet of Things, augmented reality and advanced simulation.

Making Sense of Sensors

Multi-layer integration for the IoT.

Consultant’s Corner: IoT

How enterprise IoT changes product design.

Download today

Latest News

Lenovo Delivers Expanded Portfolio of New Mobile and Desktop Workstations
Lenovo extends its collaboration with AMD in this latest product launch.

Big Tech Expected to Trim Cloud Computing Spend in 2023
For 2023, folks on Wall Street anticipate a notable slowdown in spending by major technology firms on the warehouse-size data centers...

Partnership Drives Promotion of Additive Manufacturing Camp for Young Women
The “Girl Meets Additive Manufacturing” program, for San Diego high school students, will introduce participants to additive manufacturing.

Case Western Part of New National Engineering Collaboration
The collaborations are the result of more than $100 million in grants to fund the programs.

All posts


Related Topics

Magazine Archive   All topics