Synopsys Releases Multiphysics Fusion Software for Multi-Die Chip Design

In July 2025, Synopsys acquired Ansys, a leading simulation software maker, promising to integrate the two companies' technologies. During his keynote talk at Synopsys Converge in Santa Clara, California (March 2026), Sassine Ghazi, President and CEO of Synopsys, said, "We have some products where Synopsys technology is the host that integrates Ansys technology. And some where Ansys is the host, integrating Synopsys technology. We have proven the integration in working with a number of beta customers." 

This week, the company releases Multiphysics Fusion solution for multi-die chip design, the first in a wave that's expected. In the announcement, Synopsys said, "The Multiphysics Fusion portfolio combines Synopsys' AI-powered EDA solutions with Ansys golden signoff analysis across timing signoff, design closure, multi-die design, and analog workflows."

Sanjay Bali, Senior Vice President of EDA Product Management and Strategy, Synopsys, said, “Our Multiphysics Fusion portfolio unifies Synopsys and Ansys technologies to embed physics directly into digital and analog workflows, enabling engineering teams to design across domains with fewer iterations, improved productivity and more optimized silicon for next-generation systems.”

Synopsys revealed there is significant speedup, resulting from the native integration of multiphysics solver, smarter algorithms, and efficient data exchange. For example, the software "enables up to 3x faster runtimes, SPICE-accurate multiphysics timing analysis ..." and "up to 10x faster design closure with higher engineering change order (ECO) success rates and improved power, performance and area (PPA)."

Snopsys releases Multiphysics Fusion solution for multi-die chip design, aimed at replacing loosely coupled tools. Image courtesy of Synopsys.

One of the reasons for the speedup is bypassing a workflow that requires loosely coupled tools, according to Preeti Gupta, Product Management, Synopsys. "Traditional solutions are multi-tool workflows. For example, one tool for timing analysis, another for timing sign off, and another for power integrity signoff. By natively integrating the multiphysics solvers into timing, design closure, multi-die, analog, and photonics, we are really enabling a unique solution," she said.

Synopsys cited NVIDIA, MediaTek, and Samsung as microprocessor makers who had reported measurable impact as a result of using its Multiphysics Fusion solution for multi-die chip design. 

"Advanced AI and high-performance computing platforms are pushing chip design beyond traditional workflows, and to deliver greater performance, efficiency and reliability at scale, multiphysics-aware co-design is essential," said Tim Costa, vice president and general manager of computational engineering at NVIDIA.