Digital Engineering July/August 2023

The July/August issue of Digital Engineering focuses on innovations in electronics design, including cloud-based ECAD, electronic toy design, PLM for electronics, quality control in 3D printing, and a review of the BOXX APEXX S3 workstation.

Inside This Issue:

Subscription-Based Software: The New Normal?

Licensing models are slowly changing to be subscription based across the industry. But many organizations still use perpetual licensing.  

SaaS Gains Ground in ECAD 

Simulation drives ECAD to subscription.

Playful Magic and Functional Esthetics

Incorporating electronics to raise the bar for toys and accessories. 

How Well Can PLM Support Electronics Developers?

Until now, PLM has made limited inroads into the electronics design and development sector.

Production-grade AM Gets Quality Boost 

Advances in artificial intelligence, in-situ monitoring and process control are picking away at longstanding concerns about additive manufacturing  part quality, but more work needs to be done.

Choosing the Right Computing Options for Enhanced Workflows

Getting the ideal hardware for your engineering applications isn’t just about the price tag.

Top Performance Winner: BOXX APEXX S3

The latest workstation from BOXX beats the performance of its predecessor.

Download today

Latest News

Will AI-Based Simulation Hit a Home Run?
At NAFEMS Americas, technology leaders provide guidance on how artificial intelligence can enhance simulation workflows.

Quality and Safety Drive Monitor Innovations
The latest monitors reduce eye strain while increasing visible detail.

Intel Tackles Real-World Challenges with AI Systems
Intel reports that it is empowering GenAI developers and athletes around the globe with open and accessible AI systems.

ASME Foundation Wins Grant for Apprenticeship Program in Engineering
U.S. Department of Labor funding will help train and place community college graduates with employers in manufacturing and other...

Hexagon Introduces HxGN SDx2 SaaS Solution
Solution designed to deliver a connected, insightful digital backbone for industrial facilities, Hexagon reports.

Ansys Partners with Supermicro, NVIDIA
Turnkey hardware optimized for Ansys multiphysics simulation provides flexible configurations through collaborations with Supermicro and NVIDIA, according to Ansys.

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