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Digital Engineering November 2017

By DE Editors

November 1, 2017

Inside this Issue:

Cover Story: The Heart of the Engineering Workflow

New devices, new workstation classes and HPC-incorporated workloads expand the playing field for CPUs and GPUs.

PROTOTYPE: Industrial Issues in 3D Printing

3D printing industry confronts challenges of consistency, education and more.

SIMULATION: Modeling for Change

Take a closer look at agile approaches that move away from being locked into traditional final signoff.

IOT: Building Blocks of IoT Design

The rise of the internet of things could shift the designer’s focus from system-on-a-chip to system-in-package.

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Latest News

BMF Gets FDA OK for Ultra Thin Dental Veneer Material
Zirconia materials now qualified for use in the production of thin cosmetic veneers, company reports.

Nexa3D and KVG Scale Defense Manufacturing Capabilities
The government contractor adds 15 high-speed extrusion printers from Nexa3D to meet demand for deployable 3D printing, organizations report.

KonnectAi Launches AI Quality Inspection Tool for Manufacturers
KonnectAi collaborates with Google Cloud to deliver AI-powered inspection to help manufacturers ensure quality, company says.

ASME Foundation Wins Grant to Develop Workforce
ECMC Foundation funding to help enable underserved students to pursue technical careers, ASME reports.

3D Solution, Meltio Team to Advance Metal Additive in Germany
Brauer Group's 3D Solution partners with Meltio for additive manufacturing solutions.

Next-Gen: Growing Green Space Access via Mobility
Student Competition Profile: Otis Worldwide’s “Made to Move Communities” Competition

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