Digital Engineering November 2017

Inside this Issue:

Cover Story: The Heart of the Engineering Workflow

New devices, new workstation classes and HPC-incorporated workloads expand the playing field for CPUs and GPUs.

PROTOTYPE: Industrial Issues in 3D Printing

3D printing industry confronts challenges of consistency, education and more.

SIMULATION: Modeling for Change

Take a closer look at agile approaches that move away from being locked into traditional final signoff.

IOT: Building Blocks of IoT Design

The rise of the internet of things could shift the designer’s focus from system-on-a-chip to system-in-package.

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SME Additive Manufacturing Awards Celebrate Innovation
Three awards honor research, technical innovation, career achievement at RAPID + TCT 2022.

Raymond Weitekamp: In Search of Production-Grade AM Polymer
PolySpectra's founder and CEO Raymond Weitekamp develops resin-based AM material that can go head-to-head with molded engineering plastics.

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