November 1, 2017
Inside this Issue:
Cover Story: The Heart of the Engineering Workflow
New devices, new workstation classes and HPC-incorporated workloads expand the playing field for CPUs and GPUs.
PROTOTYPE: Industrial Issues in 3D Printing
3D printing industry confronts challenges of consistency, education and more.
SIMULATION: Modeling for Change
Take a closer look at agile approaches that move away from being locked into traditional final signoff.
IOT: Building Blocks of IoT Design
The rise of the internet of things could shift the designer’s focus from system-on-a-chip to system-in-package.