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Digital Engineering November 2017

By DE Editors

November 1, 2017

Inside this Issue:

Cover Story: The Heart of the Engineering Workflow

New devices, new workstation classes and HPC-incorporated workloads expand the playing field for CPUs and GPUs.

PROTOTYPE: Industrial Issues in 3D Printing

3D printing industry confronts challenges of consistency, education and more.

SIMULATION: Modeling for Change

Take a closer look at agile approaches that move away from being locked into traditional final signoff.

IOT: Building Blocks of IoT Design

The rise of the internet of things could shift the designer’s focus from system-on-a-chip to system-in-package.

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Latest News

MachineWorks and Productive Machines Ink Strategic Partnership
This collaboration aims to introduce efficiency in machining processes, the companies report.

OpenBOM Releases Major Update for Onshape
Look for new drawing features, simplified settings, and enhanced speed, company says.

Altair and Munich Technical School Partner on Quantum Computing
Research details solutions for several key challenges of quantum computing implementation.

@Xi Delivers AI Supercomputer to University of Wyoming
Not counting the CPU nodes, this new supercomputer power reaches up to 6.3 PetaFLOPS FP64/32 peak performance.

Ansys Teams Up with Microsoft and TSMC for Photonic Simulation
Companies collaborate to speed up simulation and analysis of silicon photonic components, according to Ansys.

BigRep Unveils the DRYCON Filament Dryer
Unit is also a storage, and annealing machine for industrial-strength parts.

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