Engineers Are Working the Remote
April 1, 2011
There are advantages and disadvantages to working outside the office for everyone involved: the employee, the company and the community.
NVIDIA Launches its CUDA Toolkit 4.0, 2 in a Series
April 1, 2011
New GPU development tools makes porting engineering applications simpler.
Omega Engineering Releases IR-USB
March 30, 2011
Infrared temperature sensor has a USB interface.
Foremay Launches Small SSD Disk on Chip
March 25, 2011
The OC177 DOC disk-on-chip solid-state drive to have capacities up 64GB.
Banner Engineering Releases 2011 Product Catalog
March 23, 2011
Delivers guide for industrial automation solutions.
AMD Releases AMD FirePro 2270 and ATI FirePro V5800 DVI
March 23, 2011
New AMD professional graphics solutions enhance visual display capabilities.
Contex to Demonstrating EDM/ECM Wide Format Scanning Solutions at AIIM Expo
March 21, 2011
Company launches 'Go Wide' promotional campaign, participates in EMC Captiva's passport program.
SGI Claims World’s Largest Windows Platform with Intel Xeon Architecture
March 21, 2011
Altix UV now scales Windows Server technology to new levels.
Canfield Connector Releases Compact Magnetic Reed Sensor
March 20, 2011
Proximity sensor suitable for multiple applications.
ALT Software and Channel One Release Industrial ATI Radeon E4690 Embedded Graphics Processor
March 20, 2011
AMD's GPU screened for embedded platforms.
Eurocom Adds Intel 510 Series Solid State Drives to Mobile Workstations
March 17, 2011
Drives use SATA for up to 500MB/s transfer speeds.
SC11 Student Cluster Competition Now Open
March 14, 2011
Student teams who want to break a world record must enter by April 15.
Intel Expert Writes the Book on Embedded System
March 11, 2011
"Transitioning Embedded Systems to Intelligent Environments" being released by Intel Press.
Eurocom Adds Intel Xeon Processor X5690 to Panther 2.0 Mobile Servers and Mobile Workstations
March 11, 2011
Proessor provides more options for deploying short-term LAN-based solutions.
Tektronix to Unveil New Probes and a New Optical Sampling Oscilloscope Module at APEC 2011
March 7, 2011
While at Power Electronics Conference, company will showcase latest test and measurement technologies.
Latest News
InnovMetric Releases PolyWorks 2024
Reduces the cost of measuring in 3D by improving global dimensional management process.
Endeavor 3D Integrates Materialise’s CO-AM with HP Tech
Endeavor 3D moved to digitally transform its processes by implementing the Materialise CO-AM Software Platform to power its 3D printers...
Tech Soft 3D Buys Actify SpinFire Business
Acquisition secures Tech Soft 3D's position as provider of CAD data translation, visualization and collaboration tools for application developers and...
View a Live XR Broadcast in Apple Vision Pro?
XR, VR apps emerge to augment live events.
Investing in Success: How Training Programs Shape a Culture of Employee Retention
Customized training empowers employees, making them feel valued and engaged, ultimately enhancing retention rates.
Mercedes-Benz Funds Educational Initiatives in AI, Automated Driving at Universities
UC San Diego’s 3D imaging research allows Mercedes-Benz R&D North America (MBRDNA) to tap into the institutional research...
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New & Noteworthy
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New & Noteworthy Product Introduction: Enterprise VR Headset
Lenovo ThinkReality VRX has an immersive display works with virtual, augmented and...