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TURCK Expands BIM-UNT Sensors Line
C-Groove cylinder position sensors offer NPN outputs and flexible mounting design.
Eurocom Adds XTU and XMP Support to its Panther 2.0 Notebook
Enables users to tweak memory and processor settings.
Frost & Sullivan Researches European Sensors Market
Research service discusses the outlook for sensors market in Europe.
HPC Advisory Council Announces University Award Program
Winners will benefit from a range of resources and events.
Omega Releases Thermocouple Terminal Blocks
DRTB series come in seven calibrations.
Morgan Technical Ceramics Announces its Transducer Assembly Capabilities
Piezoelectric assembly capabilities expanded.
Supermicro 4U Storage Server Features 72 Hot-swap SAS2 Drives
Double-sided storage solution achieves high density and efficiency in 4U space.
Eurocom Launches Panther 2.0 Notebook
Features NVIDIA's SLI GeForce GTX 480M Fermi and ATi CrossFireX Radeon Mobility HD5870 cards.
DARPA Developing ExtremeScale Supercomputer System
Intel, NVIDIA, MIT and Sandia National Laboratory teams chosen to develop Ubiquitous High Performance Computing systems.
Tektronix Commits to 200GHz SiGe Technology for Oscilloscopes
IBM 8HP silicon germanium technology enables future Tektronix oscilloscope performance speed increases.
Mellanox InfiniBand Provides NASA with Cluster Performance
40Gb/s InfiniBand Gives NCCS users faster global modeling and data analysis.
Stanford University to Host MEMS Technology Summit
Two-day event to provide a lessons learned perspective on MEMS research and commercialization.
Rave Computer Introduces New Line of Engineering Workstations
Rave Ignition line available in three configurations.
Advantech Introduces PCIe-1744
High-speed analog input card has PCI Express interface.
National Instruments Releases New Servo Drives and Motors
New products provide a distributed motion solution with EtherCAT technology.



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