Fast App: At the Speed of Thought
May 15, 2013
Imagination Technologies' Caustic Series2 ray-tracing cards power high-speed design for Switch Vehicles.
Fast App: Quick as a Mouse
May 15, 2013
Duratec speeds its design cycle with 3Dconnexion 3D mice.
More Data, More Problems
May 1, 2013
HP says its Moonshot servers use 89% less energy, 80% less space and cost 77% less, compared to traditional x86 servers.
Get Ready for RAPID 2013
May 1, 2013
RAPID showcases 3D printing and more June 10-13 in Pittsburgh.
Get an Education in Simulation
May 1, 2013
The 14th NAFEMS World Congress takes place June 9-12 in Salzburg, Austria.
Simplifying Intelligent Systems Design
May 1, 2013
Intel hopes to make the "Internet of Things" participation easier for developers with its new tools and software.
Lost in Simulation
May 1, 2013
Mixing data governance and standardized processes is the best antidote to a big-data headache.
Vendors Try to ‘Rightsize’ PLM for Smaller Businesses
May 1, 2013
Making product lifecycle management more palatable to smaller businesses by simplifying configuration and leveraging the cloud.
Bright Outlook for Technical Applications
May 1, 2013
The outlook for technical applications remains broadly positive.
Social PLM Model Gets a Reality Check
May 1, 2013
Dynamic Analysis
May 1, 2013
The major building block of any dynamic analyses is an understanding of the important resonant frequencies and corresponding mode shapes.
When 3D is Not Needed
May 1, 2013
How 0D and 1D simulation can achieve large-scale design space exploration.
The Many Faces of Content Management
May 1, 2013
Product lifecycle management solutions work collaboratively with other solutions in today's dispersed work environment.
Big-picture Simulation is a Matter of Perspective
May 1, 2013
The grand challenge is putting everything together, simulating the whole system.
The Costs of the Cloud
May 1, 2013
As more engineers leverage high-performance computing, the true costs of a cloud-based model remain a mystery to many managers.
Latest News
Sustainable Packaging Requires an Innovative Data-Driven Ecosystem
Sustainable packaging is a complex challenge that cuts across several evolving manufacturing developments.
Dyndrite Awarded for LPBF Qualification
Efforts to bring documented improvements to metal 3D printing operational qualification.
Centric Debuts SOLIDWORKS PDM Connect 1.0
The new SOLIDWORKS PDM Connect 1.0 connector links files from SOLIDWORKS PDM to Centric PLM and automates the export of native ...
America Makes Winners of Open Project Call Announced
Awardees have identified the current, emerging, and future state of AM process qualification, prioritizing AM machine qualification.
GenAI Sets Off Digital Engineering Technology Shift in U.S.
Enterprises embracing new tools, agile approaches to accelerate development, according to new ISG report.
BMF Launches Hybrid Micro-Precision 3D Printer Series
The microArch D1025 dual-resolution 3D printer delivers flexible, high-precision 3D printing of parts that require micron-level precision and repeatability.
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New & Noteworthy
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New & Noteworthy: Agile Engineering Collaboration
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New & Noteworthy Product Introduction: Enterprise VR Headset
Lenovo ThinkReality VRX has an immersive display works with virtual, augmented and...