March 1, 2010 · Slice-it dice-it tools from NI, OriginLab, Tecplot, Visual Solutions, and Wolfram come with enough options to let you have it your way.
February 26, 2010 · Centre to provide a visualization experience for the plant and marine industry.
February 26, 2010 · Includes expanded model construction and system analysis functionality.
February 24, 2010 · Building higher-quality CFD meshes in less time that accurately resolve the boundary layer.
February 22, 2010 · AVX enhances its free tantalum capacitor simulation, modeling and selection tools.
February 22, 2010 · Electronics industry will gather Nov. 9-12 at the Munich Trade Fair Center in Germany.
February 19, 2010 · The USB-2001-TC thermocouple data acquisition device is now available from Adept Scientific.
February 19, 2010 · Suite includes access to GlyphWorks, DesignLife and Automation PE via annual leases.
February 19, 2010 · Meeting to take place April 13-14 in Ft. Worth, Texas.
February 19, 2010 · Allows creation and integration of documentation for Mathematica applications.
February 17, 2010 · Interface intended to streamline the design and analysis of turbomachinery components.
February 17, 2010 · Provides real-time access to smart phones.
February 17, 2010 · German car manufacturer to use multiphysics engineering simulation solutions from ANSYS.
February 15, 2010 · Simulation software award gives university academic edition licenses to support teaching and research in simulation.
February 15, 2010 · Handbook provides a tutorial for thermoelectric module operation.
February 15, 2010 · Endevco model 8515C designed for surface airflow measurements.
February 10, 2010 · Saelig Company, Inc. has announced the QuickUSB, a customizable USB 2.0 connectivity solution. This 2 x 1 circuit board implements a bus-powered Hi-speed
February 10, 2010 · High-G shock accelerometers have integral electronics.
February 10, 2010 · Servo Inclinometer family designed to withstand shock and vibration.
February 5, 2010 · ASME V&V 20-2009 standard addresses computational fluid dynamics and heat transfer.