COMSOL Announces Best Paper and Poster Awards

This award acknowledges innovative multiphysics modeling and application design work.

COMSOL has awarded honors to the best papers and posters from several of its global 2016 conferences. This award acknowledges innovative multiphysics modeling and application design work.

In addition to the events listed below, the COMSOL Conference 2016 was also held in the following locations Shanghai, China; Taipei, Taiwan; Seoul, South Korea; and Tokyo, Japan; papers and posters will posted online from these events as they become available.

Boston Best Paper Awards

  • “COMSOL Multiphysics Software as a Metasurfaces Design Tool for Plasmonic-Based Flat Lenses,” by B. Adomanis, D. B. Burckel, M. Marciniak, Air Force Institute of Technology and Sandia National Laboratories
  • “Studies of Sound Radiation from Beams with Acoustic Black Holes,” by C. Zhao, M. G. Prasad, Stevens Institute of Technology
  • “Simulation and Testing of a Tunable Organ Pipe for Ocean Acoustic Tomography,” by A. K. Morozov, Teledyne Technologies Inc.
Boston Best Poster Awards
  • “A Field Simulator for Permanent Magnet Applications,” by E. Ledwosinska, J. Gammel, Silicon Labs
  • “Modeling of Mixing-Sensitive Pharmaceutical Drug Substance Processes in Batch Reactors,” by F. Akpinar, B. Cohen, J. Tabora, A. Glace, K. Lauser, F. Lora Gonzalez, J. Albrecht, Bristol-Myers Squibb
  • “Optimization of a Thermoelectric Conversion System,” by J. R. Chase, Alphabet Energy
Munich Best Paper Awards
  • “Cracking in Quasi-Brittle Materials Using Isotropic Damage Mechanics,” by Tobias Gasch, Anders Ansell, KTH Royal Institute of Technology, Department of Civil and Architectural Engineering
  • “Thermo-Fluiddynamical Modelling of Laser Beam-Matter Interaction in Selective Laser Melting,” by K.-H. Leitz, P. Singer, A. Plankensteiner, B. Tabernig, H. Kestler, L.S. Sigl, Plansee SE
  • “Multiphysical Modelling of Keyhole Formation During Dissimilar Laser Welding,” by I. Tomashchuk, I. Bendaoud, P. Sallamand, E. Cicala, S. Lafaye, M. Almuneau, aboratoir Interdisciplinaire Carnot de Bourgogne
Munich Best Poster Awards
  • “Numerical Model for Predicting Heat and Mass Transfer Phenomena During Cake Baking,” by R. Cutté, P. Le Bideau, P. Glouannec, J.F. Le Page, Université de Bretagne Sud
  • “Simulation of the Thermal Expansion of an Inductively Heated Gear Wheel for Shrink Fitting Purposes,” by C. Hollenbeck, Z. Jildeh, T. Rydlewski, P. Kirchner, Imagine Engineering
  • “Beverage Refrigeration Simulation in Dependence on Container Shape, Material and Orientation,” by Simon Bekemeier, Lars Fromme, Andrej Genschel, Kersten Kröger, University of Applied Sciences Bielefeld
Bangalore Best Paper Award
  • “Measurement of Blood Flowrate in Large Blood Vessels Using Magnetic Flowmeter,” by S. Dasgupta, K Ravikumar, P. Nenninger, F. Gotthardt, ABB
Bangalore Best Poster Award
  • “Multiphysics Analysis of Inductive Brazing Process,” by A. F. Biju, A. Pandey, Honeywell
For more information, visit COMSOL.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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