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April 2026 Special Focus Issue: Generative Design
In this Special Focus Issue, Digital Engineering takes a look at how generative design solutions can be used across different types of design problems and with a variety of manufacturing approaches to accelerate design space exploration, and…
Electrum utilizes the 3DEXPERIENCE platform on the cloud to develop their new electric motorcycle
Electrum, a new brand of electric motorcycles, utilizes the 3DEXPERIENCE platform. Their mission is to support Indonesia’s shift to low-carbon, sustainable transport and to ultimately help the country’s government achieve its vision of net…
A key focus of this release, according to the company, is optimizing usability. Functions such as copy, past, undo and redo can now be directly done on assignments in CAD. Users can now also save and re-use combinations of search criteria for favorite materials.
Interoperability has also been extended in this release with direct support for MI:Product Intelligence. This adds reports on risks associated with critical materials and restricted substances can now be viewed within CAD or PLM software. Furthermore, materials assignment information can now be exchanged with MI:BoM Analyzer, the company's new application for assessing product risk from a BoM (bill of materials).
“At Granta we are continually striving to offer our customers tools that provide real benefits within their engineering environments,” said Arthur Fairfull, product director at Granta Design. “MI:Materials Gateway 3.0 reinforces our philosophy of creating integrated tools that help enterprises streamline their materials data management – providing a fast, flexible, and easy-to-use tool for accessing materials information exactly where and when it’s required.”
For more information, visit Granta Design.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].
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