The T3Ster is an advanced thermal tester for characterization of IC (integrated circuit) packages, LEDs and systems that produce rapid thermal characteristics. This release can convert a simulated transient thermal response into a structure function curve.
“By using an uncalibrated model for simulation, manufacturers run the risk of simply guessing performance. Calibrating the package model constants ensures the product will respond accurately in all steady state and transient applications” stated Roland Feldhinkel, general manager of Mentor Graphics Mechanical Analysis Division. “We continue to invest in leading simulation and measurement technologies to provide our customers with superior and productive capabilities to handle their most complex thermal management challenges.”
For more information, visit Mentor Graphics.
Sources: Press materials received from the company and additional information gleaned from the company’s website.

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